Electronics Forum | Wed Dec 05 17:30:02 EST 2001 | davef
How do you know that "approx 450�C" is "too high"? As a side, the temperature on the temperature sensor is: * Inaccurate. * Not the temperature at the solder. Listen, operators are smart people. They have figured-out that they can solder faster wi
Electronics Forum | Fri Dec 22 16:04:26 EST 2006 | mika
Hi, This Not so easy as one wuold think. Has the thermal pad of yours vias? How many? What's the via's dia? What is the pcb thickness? If the the pcb has a "ground layer" connected (vias) to the pcb thermal pad, it could sometimes be a little bit tri
Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon
You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to
Electronics Forum | Fri Aug 20 14:19:47 EDT 1999 | Earl Moon
| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the
Electronics Forum | Fri Dec 18 10:18:55 EST 1998 | Dave F
| I have been developing a BGA Process and are having problems with a 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the strange thing is that it doe
Electronics Forum | Sun Jun 29 02:50:37 EDT 2014 | alexeis
Hi, The issue is very complex and difficult to arbitrarily divide the types of components. From research we perform today together with our customers to design a work-at-SMT accurate as much as possible, I can summarize that vast time differences de
Electronics Forum | Thu Jul 20 12:19:24 EDT 2000 | Dave F
Bob: Techniques for removing RFI / RF shields vary according to the size and type of shield. Removing: * PTH RFI / RF shields is as straight forward as the next heat sinking PTH component, often using a solder bath or fountain. * Small SMT RFI /
Electronics Forum | Sat Jul 21 09:27:45 EDT 2001 | davef
No. There's nothing fancy. You need enough solder on the exposed pad for a good thermal connection, but not so much to lift the comonent off the TSSOP pads. We reduce the aperture for the pad, dunno 85%, with four windows [but it doesn't matter ho
Electronics Forum | Thu Jan 20 02:36:29 EST 2000 | erico
Hi wolfgang,Dave & PC: What I facing are: 1. The component lie flat on the board but only one side can get solder.The pad is ok, problem is with the chip. 2.I desolder the chip and go to view it under microscope and found that there is a line near t
Electronics Forum | Thu Jan 20 11:20:28 EST 2000 | Brian W.
It sounds like what you are seeing is leaching of the end cap. You need to check the manufacturer's spec. Many components have terminal barriers, which get a solder plating. Sometimes this plating process is not done well, and the solder plating le
