Electronics Forum: lifted pads (Page 12 of 22)

Tombstone components issue after reflow?

Electronics Forum | Mon Aug 14 03:25:51 EDT 2017 | spoiltforchoice

There is no solution in above case, this is > caused by the PCB design. There are no > thermals on the pads connected to the copper > poured area. So the other pad reflow first and > lift the component. Yes, this. You could try playing with

132 QFN footprint

Electronics Forum | Thu Aug 16 09:42:15 EDT 2007 | russ

This could be the reason for the mask defined pad. ERROR in docs! This happens a lot. I believe this to be case honestly, I would not use mask defined pads for these. If you get a registration shift in mask which is likely you will run into troub

Use of Pb-free Components

Electronics Forum | Fri Mar 19 11:48:06 EST 2004 | Ken

This is the dilema during this transition period. Here is a tip: If you see typcial solder joints on a lead free process, but only on one component type....it probably has a significant quantity of lead in it (ex. Sn90/Pb10...and so on) If using T

PCB Delamination

Electronics Forum | Tue Nov 25 11:35:11 EST 2008 | wavemasterlarry

Listen, I conqure with with wAyne on this one as your board house is always gonna the first person y a blame if you haven't adjusted any process paarameters in a while and see board related issues that can be traced to the board house. I once though

Soldering

Electronics Forum | Wed Dec 05 17:30:02 EST 2001 | davef

How do you know that "approx 450�C" is "too high"? As a side, the temperature on the temperature sensor is: * Inaccurate. * Not the temperature at the solder. Listen, operators are smart people. They have figured-out that they can solder faster wi

Yield on 0402 SMT Printed Circuit Board Assemblies

Electronics Forum | Wed Jan 10 20:06:43 EST 2007 | SSS

I've been assembling thousands of boards for dozens of customers over the past 5 years with 0402 chip components. 85% can happen very easily even with newer equipment. Defect challanges with 0402 packages is almost always tombstoning. Capacitors abou

DFM of a unique polarized cap

Electronics Forum | Thu Jul 01 20:47:48 EDT 1999 | Scott McKee

I called a new customer today and told him that one of his parts on the proto boards (a capacitor with a polarity 'tit') was too long for the pads and the pads were small causing the end opposite of the "tit" to lift up. I suggested that the product

Assemby of flexible printed circuits

Electronics Forum | Wed May 16 15:40:56 EDT 2012 | davef

Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies

Re: reliability of epoxy

Electronics Forum | Thu Aug 06 02:25:21 EDT 1998 | P.L. Sorenson - Technical Consultant

| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the

Teflon PCB's

Electronics Forum | Fri Oct 26 17:01:52 EDT 2001 | davef

We process no Teflon boards. Companies, such as Rogers and Taconic, make laminates of Polytetrafluoroethylene [PTFE] er �Teflon�. Common �Teflon� laminates are: * Woven glass / PTFE * Random microfiber glass / PTFE * Ceramic / PTFE * Woven glass /


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