Electronics Forum: melf (Page 12 of 15)

Adhesive printing

Electronics Forum | Thu Jan 31 07:02:00 EST 2002 | martino

The whole process counldn't be easier. The sales reps' try to turn the whole thing into some crazy black art-its not. The stencil supplier will have their own standard 'glue dot' configurations, and 9 times out of 10 these are more than adequate. As

Reliability of U-shape appetures

Electronics Forum | Wed Jul 03 07:40:48 EDT 2002 | Yannick

Hi, WE are making some test with this kind of component and aperture and here what we think. when you use a home plate aperture it's seem that the component is not lenght enought to have a good solder but maybe is our CAD guy that didn't make a

Reliability of U-shape appetures

Electronics Forum | Tue Jul 09 08:29:10 EDT 2002 | r_sturdevant

I agree with others here who have questioned the amount of solder and reliability of the joint when using this aperture shape. I have had experience with these with MELFS, and the main issue I've seen comes when cleaning the stencil - all those littl

whitepaper for the lead pitch standard

Electronics Forum | Fri Oct 22 07:31:24 EDT 2004 | davef

We're unclear about what you're seeking, but in order to move the conversation along, are you looking for: IPC-SM-782A - Surface Mount Design & Land Pattern Standard ANSI Approved Get up-to-date land pattern recommendations for ball grid array pac

0.5 mm pitch BGA

Electronics Forum | Wed Mar 02 06:19:03 EST 2005 | pjc

Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components

0201 Land Pattern and Aperture Shape Design

Electronics Forum | Thu Mar 10 09:13:15 EST 2005 | davef

From http://www.IPC.org ... IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, includ

Wave soldering after SMD assembling

Electronics Forum | Mon Nov 07 07:50:41 EST 2005 | pjc

6 deg is std angle. Some machines have option to adjust angle from 5 to 7. Maybe yours does. If you have an Electrovert wave machine you can get the Omega option. This option vibrates the wave to reduce surface tension. It does a nice job on rectangu

Problems with diode during wave soldering

Electronics Forum | Thu Sep 13 15:44:02 EDT 2012 | mbnetto

Hi everbody, I'm facing some soldering problems with a Diode (SMA) during wave soldering process. During this process almost all the time one of the component pads have no solder, according to the picture dsc000604 attached. Some considerations: * T

Share info for Six sigma - BB

Electronics Forum | Sat Mar 03 14:51:22 EST 2001 | stefwitt

Hi Dave, I think 6 sigma is here to stay. Unlike any other programs like ISO, six sigma goes to the people�s mind. With drastic examples like � you would not fly a plane which reaches its destination in a three sigma probability � you start to think

Re: feeder width

Electronics Forum | Tue Mar 30 10:57:54 EST 1999 | Steve Gregory

Hello, I'm a student assistant in a research project that deals with the simulation of PCB assembly systems. At the moment I collect information about SMDs. My problem is how to assign the correct feeder width to various devices in a simulation. Is


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