Electronics Forum | Tue Feb 01 06:54:19 EST 2000 | Roni H.
Hi, Does anyone have experience with gold over nickel (electroless) PCB finish: - Repeatble quality from PCB mfg. (very "painfull" with ENTEK). - Environment condition sensitivity. - Thermal processes sensitivity. - Solderability (Reflow & wave). -
Electronics Forum | Mon Oct 11 09:56:00 EDT 1999 | D Scott
A board shop rep contacted me about a process were solder paste is applied to the board as part of their mfg. process thereby eliminating the need for paste application at the assembler. This is a new one I have never heard of, but am willing to sit
Electronics Forum | Thu Jun 03 15:00:48 EDT 1999 | Deon Nungaray
.020" pitch spacing. Which have yielded my process excelent results. My main stencil supplier is I-Source in Irvine, CA and has pretty much standardized on 100% lazer cut stencils for competetive pricing. Hope this helps. Deon Nungaray SMT Mfg. Eng
Electronics Forum | Tue May 25 10:49:34 EDT 1999 | Deon Nungaray
.025" you should wipe under stencil surface after every 2 or 3 print cycles with a lint free cloth or lint free tissue. When performing this operation you can also lightly soak cloth or wipe in alcohol. Regards, Deon Nungaray SMT MFG Process Engin
Electronics Forum | Fri Dec 18 00:49:43 EST 1998 | Mr Mariscal
I have been developing a BGA Process and are having problems with a 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the strange thing is that it does
Electronics Forum | Fri Dec 18 00:48:35 EST 1998 | Mr Mariscal
I have developing a BGA Process and having problems with 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the stange thing is that it does not happ
Electronics Forum | Tue Aug 07 12:18:37 EDT 2001 | delnosa
Looking at ideas for "best in class" process controls for SMT mfg. ops. Wanting to add improved p-controls at some of our suppliers and I'm looking at what others may or may not recommend. Already looking at the following: Solder Printing X-Y-Z axis
Electronics Forum | Mon Nov 12 12:00:30 EST 2001 | caldon
A real small soldering iron, a real steady hand, a qualified solderer. Soldering skill set is key. Iwould sugest a Micro scope. Sonora Mfg (I am sure there are others)has an infinate scope that you can solder under. aside from that....skill set.
Electronics Forum | Mon Nov 26 14:48:43 EST 2001 | PeteC
The tooling fixture has tooling pins to accomidate your PCBs. Typical PCB tooling holes are 0.125" dia. non-plated thru holes and 0.250"x0.250" from the edge of the PCB. Check out this link to EMC Global Technologies. They mfg. tooling fixtures for U
Electronics Forum | Mon Apr 22 09:07:43 EDT 2002 | pjc
Francis, The potting encapsulation process was in the mfg. of flash-disk devices built on a DIP formfactor. Compact flash do not normally get potted. Ultrasonic welding or snap-togther is methods for closing the compact flash housing. The potting mat
