New SMT Equipment: peelable solder mask (Page 12 of 25)

Mass-Production-PCB-1-22layers

Mass-Production-PCB-1-22layers

New Equipment |  

1-22 Layers PCBs FR-4, Rogers, High Tg FR4, CEM-1, CEM-3, etc. Material 0.4-6.0 mm Board Thickness Lead Free HASL, ENIG, Immersion Tin, Immersion Silver, OSP etc. Treatment Green, Red, White, Yellow, Black, Blue Solder Mask

Shenzhen Longkun Technology Co.,Ltd

Double sided PCB

Double sided PCB

New Equipment | Components

1) 120*130mm/1up, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz 4) Min. hole size: 0.3mm 5) Min. track/space: 4/4 mils 6) LPI Solder mask/White legend 7) Fiducial mark, tooling strips, mounting ho

Bicheng Enterprise Company

Blind via PCB

Blind via PCB

New Equipment | Components

1). 1+C+1 HDI, blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel

Bicheng Enterprise Company

PCB Prototype - 2 Layer, Hard Gold Plating 30u

PCB Prototype - 2 Layer, Hard Gold Plating 30u

New Equipment | Prototyping

PCB Prototype - 2 Layer, Hard Gold Plating 30u", Controlled Deep Cut/Milling And Special CNC - 2 layer, hard gold plating 30u", controlled deep cut/milling and special CNC. - Red solder mask. 

D-Ying Electronic Inc.

PCB manufacturing service

New Equipment | Assembly Services

100% manufacturability check prior to production IPC Class 2 specifications 100% electrical test on all boards Fully-finished PCBs with 2 solder-masks and 1 or 2 silk-screens Full finish on copper: HASL, RoHs, gold or silver .  1

Caring Circuit Tech Limited

Printed Circuit Board fabrication accept OEM service

Printed Circuit Board fabrication accept OEM service

New Equipment | Fabrication Services

Specifications: Base material: FR4 Layers count: four Board thickness: 1.6mm Copper thickness: 1oz Surface finishing: immersion and gold finger Solder mask color: green Size: 125.09 x 95.25/1up SMT SMD, 230 DIP and 4 pieces component

Shenzhen Aobo Technology Co.,Ltd

SCS Dip Coating Systems

SCS Dip Coating Systems

New Equipment | Coating Equipment

SCS Dip Coating systems, which are available in free-standing floor or tabletop models, are specifically designed for production applications that do not require large in-line systems. SCS dip coating systems can be used to apply a range of coatings,

Specialty Coating Systems

ENIG FR4 Power supply PCB shenzhen maker

ENIG FR4 Power supply PCB shenzhen maker

New Equipment | Prototyping

4Layer PCB TG≥135 degree PCB thickness: 1.6mm Copper thickness:4OZ Green solder mask White silkscreen Surface treatment: ENIG Min Line/space: 20/20mil Min hole: 28mil Brand Name:SYSPCB

Shenzhen SYS Technology CO., Ltd

COB LED MCPCB Prototype huanyupcb.com

COB LED MCPCB Prototype huanyupcb.com

New Equipment | Prototyping

Layer: Single-Sided Price:USD275.50 Quantity :3Panel Min Holes:2.00mm surface Treatment:ENIG solder mask:White  silk screen : Black Board Thickness: 1.6mm  Cu Thickness: 35um  Aluminium Model: 5052  Thermal Conductivity: 150W/m. K  Breakdown Voltage:

PCB Manufacturer HuanYu Technologies Co., Ltd.

Copper Core Single-Sided  Prototype PCB huanyupcb.com

Copper Core Single-Sided Prototype PCB huanyupcb.com

New Equipment | Prototyping

Layer: Single-Sided Price:USD295.50 Quantity :10pcs Min Holes:2.00mm surface Treatment:ENIG solder mask: Black silk screen :White  Board Thickness: 3.0mm  Cu Thickness: 70um  Thermal Conductivity: 220W/m. K  Breakdown Voltage: AC2KV-7KV 

PCB Manufacturer HuanYu Technologies Co., Ltd.


peelable solder mask searches for Companies, Equipment, Machines, Suppliers & Information

High Throughput Reflow Oven

Software for SMT placement & AOI - Free Download.
Thermal Interface Material Dispensing

Training online, at your facility, or at one of our worldwide training centers"
Void Free Reflow Soldering

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
thru hole soldering and selective soldering needs

Easily dispense fine pitch components with ±25µm positioning accuracy.
Electronic Solutions R3

Thermal Transfer Materials.