Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
We use only the Hi-tech placing machines for our production. Our production capacities : 40.000 comp. per hour. We are able to assemble following SMD components : 0201 Chip, BGA(45x45), uBGA, Best fine pitch QFP, SMD Connectors, etc.
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Used SMT Equipment | Pick and Place/Feeders
This 1998 Philips Eclipse with LCS is a flexible placement machine. Left to Right. This Eclipse was made for fine pitch placement and smaller components down to 0402. It is versatile and extremely good at a small runs and prototype application. Singl
Used SMT Equipment | Pick and Place/Feeders
This Philips CSM Eclipse Flexible Placement Machine, is left to right. The CSM Eclipse was made for fine pitch placement and smaller components down to 0402 size components. It is versatile and extremely good at a small runs and prototype application
Used SMT Equipment | Pick and Place/Feeders
MG1 machine with ITF FES interface. In excellent condition The MG1 delivers a perfect balance between high mix and high accuracy. Placement capabilities range from 01005 and large, fine pitch QFP's to tall components and odd form parts chip
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Used SMT Equipment | Pick and Place/Feeders
2009 UIC GX-11 GSXB542 Flex Head Fine Pitch Placer with DTF. Recently removed from production in great working condition. FOB: Origin Contact: Assured Technical Service LLC AssuredTechnicalServiceLLC@Gmail.com
Industry Directory | Consultant / Service Provider / Manufacturer
One of the major suppliers of stencils and pallets to the SMT industry. Stentech offers Electroformed and laser cut stencils, pallets and fixtures.
Used SMT Equipment | Screen Printers
The MV-100 uses production-proven technology. It is fitted with sophisticated menu-driven control software for fast set-up and ease of use, making it one of the most user-friendly printers available. The tooling system is SMEMA compliant and will pro
Industry News | 2022-12-26 11:34:19.0
ZESTRON is pleased to announce that ZESTRON's Senior Application Engineer, Ravi Parthasarathy will be presenting, "Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs", at IPC APEX 2023 taking place in San Diego, California.
