Electronics Forum | Mon Jul 19 12:37:15 EDT 1999 | Wolfgang Busko
| | | | | Hi, SMTASSY | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | First, we do not do real series produktion, only prototyping up to som
Electronics Forum | Tue Jul 20 05:29:14 EDT 1999 | Wolfgang Busko
| | | | | | | | Hi, SMTASSY | | | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | | First, we do not do real series produktion, only prototypi
Electronics Forum | Wed Sep 11 12:52:14 EDT 2002 | slthomas
We have found that using the SPC capability of the profiler's pc software helps us identify oven malfunctions sooner than we would normally find it. The ovens tend to compensate for dieing or dead blowers by cranking the heaters on for longer cycles
Electronics Forum | Tue Aug 13 02:33:04 EDT 2019 | ameenullakhan
Hi , Thanks for the reply. Yes CCGA was checked before placement and sending to reflow oven. The latest suspect form few cross functional team member is like. It is due to improper reflow profile " Column kick out " has happen. I am
Electronics Forum | Thu Mar 12 06:37:48 EDT 2009 | gregoryyork
I agree you are too cold for the profile get it up to 230C and possibly allow it to dwell a little longer in preheat as opposed to pushing up the reflow zone only. Sn90/Pb10 melts at 220C so 2C hotter than your profile so you are reliant on it alloyi
Electronics Forum | Tue Jul 30 05:28:47 EDT 2019 | ameenullakhan
Your inputs are always valuable and help a lot. Thanks for the inputs.
Electronics Forum | Tue Jul 30 09:50:51 EDT 2019 | ameenullakhan
Attached is the image of lead lift in ccga
Electronics Forum | Wed Jul 05 11:37:38 EDT 2006 | dougs
I my last company i had to battle all the time for tooling to set up jobs, i asked the product engineering manager to include extra panels in the costs for NPI to be used as reflow profiling panels, he told me they had never needed these before and t
Electronics Forum | Mon Jan 17 17:38:29 EST 2011 | bandjwet
All: I am reaching out to get some suggestions on the right flux to use as well as a recommended cleaning process for soldering a KOVAR RF shield using 80/20 Au/Sn solder to a ceramic hybrid. The recommended profile is 4-5 min at 280C and at least
Electronics Forum | Tue Mar 09 18:21:37 EST 1999 | Stan Levitsky
We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce br
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