Electronics Forum | Mon Apr 02 01:24:52 EDT 2007 | Haris
Dear all, I want to know the difference between the CSP and the BGA (I think there is only in the mesh pin difference). Secondly, if their solder balls have same dia, LxBxH are also same with the the manufacturing of the pin coating chemical elemen
Electronics Forum | Mon Aug 24 03:59:26 EDT 2009 | hurr
Hallo Joanne, I had employed by producer of Ecofrec 303. We make many tests of corrosion and conductive test in our company. All results of this tests was OK . Vast majority correspond mil standarts. When I ask my labor assistent in BRY, white residu
Electronics Forum | Fri May 15 21:39:48 EDT 2015 | jlawson
Reflow.. 1.Rehm (Germany) - Best in Class Best overall process stability heating system ( Alot of makers have started to copy there VX heating arrangement ). COnveyor chains can be a bit more attention in terms of maintenance on rehm , but if foll
Electronics Forum | Sat Jul 26 07:42:49 EDT 2008 | pcbbuilders
I am not very concerned about production time, but it is always a thought! Quality is more importnant of course. We have 2 different pastes, with almost identical requirements. We can get close to their profiles, but i am worried that i am spending
Electronics Forum | Mon Aug 04 09:30:16 EDT 2008 | grics
If you have concerns, you can look at the datasheet for each component or contact one of their application or materials engineers and find out what the components are rated for...process-wise. IE, how long can I be in the oven with this part, at what
Electronics Forum | Mon Dec 22 14:52:18 EST 2008 | wrongway
We run our process like that all the time paste then glue we use same profile as if we were just reflowing paste once in a while we have A plastic bodied part that has that problem we asume it was some mold relase still on the part basicly comtamena
Electronics Forum | Wed Apr 21 14:32:52 EDT 2010 | remullis
These ovens maintain good profiling as long as you stay on top of maintenance. I had 4 150's and 1 125. The biggest headache is keep the plenums cleaned (very messy). Also the blower motors have been replaced a few times on them as well. If I were yo
Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101
I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the
Electronics Forum | Fri Feb 27 11:33:32 EST 2004 | Bryan
Very strange question,but interesting.Is there anyone who have conducted any experiments to figure out the results?I made a profile board,one thermal couple on pad and other one drilled into the ball of BGA.the 2 points are perpendicular to conveyor
Electronics Forum | Fri Jul 25 15:54:22 EDT 2008 | pcbbuilders
I am trying to optimize my reflow profile. i have a 5 zone oven. lead-free: for the 1st 3 zones, i am good, at about 150-200 deg for 150 seconds. during the 4th zone, i am at a temp of 200-220 for 50 seconds. during the 5th zone, i am at 220-245 f
