,Texas Instruments Inc., Dallas, TX ABSTRACT Minor voiding in
SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering
Optimizing Thermal & Mechanical Performance in PCBs Optimizing thermal and mechanical performance in PCBs Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn
