Electronics Forum | Fri Nov 13 20:17:35 EST 1998 | Chuck Garth
| | I believe that gold fingers on my circuit boards are being | | contaminated and need to clean them with some chemical | | solution. Any recommendations. | | | Chuck: What is the type and source of your contamination? Dave F | We are using a s
Electronics Forum | Mon Jun 17 21:31:23 EDT 2002 | davef
Most of our discussions here on SMTnet have focused on underfills. With transfer molding, voiding near the die, wire bonds, or leads contribute to more failures than others. Try: * Tim Chen, Cookson Semiconductor 800-223-9057 * Ron Molnar, Abpac In
Electronics Forum | Wed Apr 30 21:00:36 EDT 2003 | davef
ENIG is a common solderability protection on BGA packages. Pd/Ni/Au while more expensive could have advantages over ENIG in the following area: * Allow both gold and aluminium wire bonding * Better solder resist compatibility (63�C max) * Might take
Electronics Forum | Tue Apr 06 17:01:24 EDT 2004 | davef
It doesn't make sense that contamination would form on your gold pads after prebake of 150C for 3 hrs. The contamination must have been there prior to the bake. Your description makes us think of solder mask bleed. Tell us about: * Solder mask * S
Electronics Forum | Wed Jan 19 19:47:16 EST 2005 | davef
It depends. Let's focus. The basic versions of COB are: * Semiconductor die that you place on a glued board surface, wire bond, and then encapsulate. [The crazy uncle of the COB process, accounting for 90% of the placements.] * Semiconduct die tha
Electronics Forum | Thu Mar 05 21:31:35 EST 2009 | davef
Bill: We're pretty sure these guys don't offer the parts that you seek, but they maybe able to give you a lead. * Topline Dummy Components - http://www.topline.tv * Practical Components - http://www.practicalcomponents.com So, how about your equi
Electronics Forum | Fri Feb 12 05:53:32 EST 2010 | muarty
Hi Flipit, One of our customers has recently changed to this type of finish on their PCB's, due to them wire bonding MMIC devices in their factory after we do the SMT build. We found that we had to change all of our stencils for these products, as t
Electronics Forum | Thu Dec 18 08:18:48 EST 2014 | kevinb
Does anybody know what material is used for over molding I/Cs. I would like to find a material that others use to mold there electronic components. I am wire bonding and mounting a small cap (0201) on an FR-4 board. I need this material to withsta
Electronics Forum | Mon Mar 11 10:43:06 EDT 2019 | herve53
Hello, Is somebody could support me ? I would like to understand what is the chip on board process. What are process steps to produce a die in COB ?(please with technical details) (from start of the line to end of the production line, cleaning, pick
Electronics Forum | Thu Sep 08 07:04:02 EDT 2005 | davef
Finer pitch: Wedge bonding can be designed and manufactured to very small dimensions, down to 50 mm pitch. Processing speed: Machine rotational movements make the overall speed of the wedge bonding process less than thermosonic ball bonding. Alumin
