Electronics Forum | Thu Jun 09 19:09:37 EDT 2005 | Kantesh Doss
We verify oven profiling once a week on a scrap board and enter the data in a SPC Chart. This works out great and I have not noticed any problem. I also like the idea of sending the Profiler through the oven with the thermocouple sticking out to meas
Electronics Forum | Mon Jun 06 00:42:52 EDT 2005 | Dr. K
Hello all. I would like to implement a process in our SMT site. The process purpose is to reduce the scrap level from our SMT line machine (siemens). I would like to hear some advices for that kind of process. -preventive actions I should implement
Electronics Forum | Fri Jun 10 21:22:36 EDT 2005 | KEN
JD, fiducials are merely land marks. The vision processor will measure the actual location and compare it to the CAD location. It does not care if the design is symetrical, asymetrical or what. In the case of a single center design fiducial (which
Electronics Forum | Fri Jun 17 23:31:12 EDT 2005 | kenscj
Hi all, currently, we are seeing BGA problem like solder ball misalign, void, solder short (all under BGA, tested with 5DX), after reflow. We examine the solder ball (raw material of BGA), and see that the ball surface is not smooth, will that affe
Electronics Forum | Thu Jul 14 10:41:27 EDT 2005 | slthomas
I guess I took too much time editing my response. :P The bottom line is that unless you're measurements are at least as repeatable and accurate as your machine's closed loop systems, it's a waste of paper *BUT* makes nice wall art for tours. I like
Electronics Forum | Tue Jul 19 14:29:12 EDT 2005 | ppwlee
What are possible failure analysis (destructive or non-destructive and what are the pro/cons) I could conduct on the component level (of an IC) to determine failure mode/root cause? We are measuring internal shorts between leads on a SOIC after sold
Electronics Forum | Tue Aug 09 13:15:27 EDT 2005 | davef
Initial points for investigation are: * What temperatures are you measuring on the leads that do not reflow well? [How does this match with the paste supplier's recommendation?] * Does the component take solder after being dunked in the solder pot? *
Electronics Forum | Thu Aug 25 19:37:18 EDT 2005 | Dave
Hi Mark, Check out Heller's white paper link for a study done with a PCB in line with thick and thin aluminum plates to measure repeatability and delta T with loads of large mass materials. The result was less than 1 degree with their oven due to i
Electronics Forum | Tue Aug 30 22:38:54 EDT 2005 | cabs
Does any one knows where to get a plating thickness meter that can be use in the fine pitch contacts and trace in PCB application like BGA pads? If there's a hand held device at lower cost much better... Also if you can recommend companies that offer
Electronics Forum | Fri Sep 16 12:58:49 EDT 2005 | vikkaraja
Fuji sells a PAM kit. It includes all the needed things you will need to accomplish this. It has a reel of 1206 black colored chips, doule sided tape, PCB, flopy with PAM program , and a ram card for the particular machine. I hope it help you some. G
