Electronics Forum | Fri Aug 21 13:43:13 EDT 1998 | Ben Salisbury
| Hello everyone, | I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible s
Electronics Forum | Wed Oct 17 17:43:27 EDT 2001 | davef
2) Open time: A 15-minute queue between paste, place, and reflow SB fine, assuming humidity is not too great. 3) Wash temperature: Yes. A wash temperature of 130-140�F SB fine. 4) Reflowed board was left too long prior wash: Are you washing: * After
Electronics Forum | Mon Dec 07 12:08:14 EST 1998 | Michael Eisenbarth
We are investigating the solder process for reflow soldering THT components on single sided PCBs. Are ther any test specifications (mechanical or temperature tests) for that kind of assembly?
Electronics Forum | Wed Dec 15 10:37:55 EST 2004 | gopinath A
Thanks Dave, That answers my question. I didn't think either that the qty of gold in platings would be enough to contaminate the solder pot. I wanted to make sure that leach test is a valid test for gold finishes. Gopinath@mcl.com
Electronics Forum | Thu Feb 17 12:04:52 EST 2005 | Indy
Have you tried doing solder dip test on these components? Or a Leaching Test, to see if the solder catches on the termination ? I suggest you should try these tests.. Cheers Indy
Electronics Forum | Wed Jul 15 05:36:34 EDT 1998 | Stoney Tsai
Bare board solderability plays a significant role of forming good solder joint. Currently, I can not find any information about bare board solderability testing procedure or methods. I think the procedure of testing should have some differentiations
Electronics Forum | Sat Apr 08 09:32:51 EDT 2000 | Matt
Make sure your screen aperture size is about 80%, and you should not have a problem. Some pastes require a hump profile, to get rid of balls.
Electronics Forum | Wed Feb 17 16:39:05 EST 1999 | 3D
What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same.
Electronics Forum | Mon Jan 11 16:16:52 EST 1999 | Jenna Sweterlitsch
This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? Thanks!
Electronics Forum | Thu Apr 09 15:44:36 EDT 1998 | Earl Moon
| Is there a good way to inspect BGA | balls ? Is there an inspection piece | of equiip.? It depends on what you intend inspecting. For dimensional and tolerance measurements, I have used optical comparators. For solder ball voiding, X-Ray is used.
