Electronics Forum | Tue Sep 18 13:21:06 EDT 2001 | fcouture
Hello Jeff, I found some good information from what I read until now...so thank you! I have two questions: 1) What finish did you use on the PCB for 0201 ? I think with an aperture so small (12x15mils) tin plated is impossible, what do you think
Electronics Forum | Wed Sep 19 16:02:14 EDT 2001 | fcouture
Pad Metallurgy Used: >Is your question about this targeting the current industry capability of using tin plating technology on such small >pad dimensions? Actually I should have asked for tin/lead plating (HASL) and yes it's to have an idea on capab
Electronics Forum | Mon Oct 01 09:42:42 EDT 2001 | ac
Darren , I done the HNC in Electrical & Electronic Engineering which was later changed to Mechatronics . The course itself will give you a good broad based grounding in all aspects of E&E Engineering . What you really need to back it up is good quali
Electronics Forum | Thu Sep 20 16:51:31 EDT 2001 | jschake
Using an enclosed pressurized printhead system will significantly reduce the waste produced compared to printing glue using squeegees. In trying to stay with the 0201 theme here, I will add that printing glue or adhesive for 0201s continues to be a
Electronics Forum | Fri Sep 21 10:44:34 EDT 2001 | slthomas
You can, and for small parts you probably won't see much difference between body temp. and lead temp. For QFPs or PLCCs there will be a much greater delta, though. I'd be more concerned with the small surface area you're making contact on (spherica
Electronics Forum | Fri Sep 21 16:00:55 EDT 2001 | davef
In addition to providing guidelines for BGA inspection and repair, IPC-7095 also addresses reliability issues associated with BGA: 7095, �Design and Assembly Process Implementation for BGA's� Your boards should be assembled in conformance with: *
Electronics Forum | Tue Sep 25 15:11:34 EDT 2001 | Rich Elensky
I have had good experience with the 6500. We used it to inspect both SMD and TH devices. (presence, polarity, correct part) I would suggest you contact CR (now Phton Dynamics) for the latest software. It has some serious improvments over early rel
Electronics Forum | Mon Sep 24 11:12:56 EDT 2001 | nwyatt
Hi. We are currently using an unconventional method to rework a micro BGA - removing component with hot air, fluxing the area, placing the part with pick and place, then reflowing it in the oven. The reason we are doing it this way and not with a r
Electronics Forum | Tue Sep 25 12:49:58 EDT 2001 | Hussman
Been there - done that. Makes a mess on that 2nd reflow process- doesn't it!?!?!? This is caused by design. If the open via is located in the land area, it will flow thru the via and cause pumps on the opposite side. You can have your vias filled
Electronics Forum | Wed Sep 26 11:54:02 EDT 2001 | Stefan
John, you mention yourself that this problem is component related. Is the 1206 presented out of a plastic tape?. The tape could be more slippery than the paper tape and the cover tape may pull the tape out of position. I am not familiar with the Juk
