Electronics Forum | Thu Jul 13 10:10:48 EDT 2000 | Todd
Donnie In response to your questions; 1. Flux is Multi-core X32-10M 2. Preheaters temperatures can range based on board density. the goal is to get the top side to 100C before wave. 3. Components can't be placed after wave solder, they are surface m
Electronics Forum | Fri Jun 30 13:45:20 EDT 2000 | Paul Wright
Ioan, It looks like the JEDEC Standard is a place to start. I think it would be possible to have people follow the standard internally. Getting the external customers to follow will be difficult at best. But if its possible to develop a close rela
Electronics Forum | Thu Jun 22 11:21:59 EDT 2000 | Chrys Shea
My personal opinion: Use 20 mil squares with the corners radiused at 5 mils. The squares offer 2 benefits: 1) A little more paste, which makes for a higher diameter solder column that is more reliable 2) Better stencil release of the paste. It's e
Electronics Forum | Tue Apr 03 00:55:34 EDT 2001 | philipreyes
Hello Billy!! IPC 7095 covers all the design rules and guide lines in BGA assembly and inspection, this will help you a lot in your problem...But based on your problem, it seems that all the balls were disappeared, try to check the capability of
Electronics Forum | Thu Jun 01 21:54:00 EDT 2000 | Dave F
Jeremy: Standards: � A-600 talks about percentage of solder mask loss allowed, according to the location (eg, laminate, bare copper, gold or nickel, melting metals) and equipment class. � A-610 talks to "Solder Resist Coating - Voids & Blisters" by
Electronics Forum | Tue May 30 09:27:08 EDT 2000 | PhilB
More and more PCB fabs are switching from chemical copper to what is called a "black hole" process from McDermitt.In this process a very thin layer of carbon is put on the base material instead of chemical copper. Can anyone tell me about the advanta
Electronics Forum | Thu May 04 05:04:04 EDT 2000 | Richard Durrant
I have a few lcc devices that have large metal areas on their bases that require them to be soldered to the board for thermal and electrical reasons. I have provided a large copper pad and thermal vias, but how do I describe the solder stencil inform
Electronics Forum | Fri May 05 05:51:44 EDT 2000 | Joe
Thanks for the info. Our system is capable of holding the set limits, but since breakdowns do happen I am considering what to do. So while everything is running, we have a climatic controlled area. The min. relative humidity of 40% comes from the JE
Electronics Forum | Wed Apr 19 18:02:34 EDT 2000 | Mike Flori
If you can divide your boards into different categories it allows you to determine a different starting profile for each category, based on size, # of layers, etc. When you get a new board to profile you'll have an idea what settings will get you clo
Electronics Forum | Fri Apr 14 19:09:38 EDT 2000 | Ashok Dhawan
One of our customer insist on repair of solder mask even if it is pin holes or less than 0.010 sq in. area. Based on our knowledge bank, we though of thre options, there could be many more. 1. coat the exposed area with original solder resist (from
