Electronics Forum | Mon Feb 20 23:01:05 EST 2012 | davef
Services, Recycling, Electronic boards * American Scrapmetal; 7120 Rufe Snow Dr, Suite 106-184, Fort Worth, Tx 76148; 817-891-5297 americanscrapmetal@hotmail.com http://www.americanscrapmetal.com * Clean Harbors, Inc; 1501 Washington St, PO Box 8590
Electronics Forum | Mon Aug 25 12:43:35 EDT 2014 | freddimock
Numerous people use the Pyramax oven to process high temp solder but your success will depend upon the mass of your board. To maximize the probability of success you should use the highest convection rate (IWC) possible to enhance heat transfer an
Electronics Forum | Sat Jul 02 10:27:19 EDT 2022 | madisreivik
Hello ! I got exp only with leadfree HASL, but maybe the same problems apply. Also, the leaded HASL has probably lower process temperature. This could be copper, which has settled to the tank bottom. With leadfree, the copper is removed from molten
Electronics Forum | Wed May 05 03:57:00 EDT 1999 | Bernard Mulcahy
| Hi Ya' John! | | Here's my comeback to the points you've raised...you knew I would have a comeback, didn't ya'? | | |Steve, | | | | I see your point, and yes there are alot bigger fish to fry in |the removal or control of lead in the environment
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
Electronics Forum | Thu Jan 18 21:52:24 EST 2001 | arul2000
>>>>Dave, The BGA substrate surface finish is NiAu, while the PCBA pad surface is HASL. The solder ball composition is SnPb 63/37 and the solder paste used on the PCBA is also the same but with 2% Silver.>>> Dave, sorry I don't have the picture with
Electronics Forum | Tue Dec 12 13:45:23 EST 2000 | justin m
Dross removal is dependent upon the "activity" in your solder pot and the usage of a inert or an "air" atmosphere. The more moving parts that agitate the solder and expose it to air, the more dross. Basics first and then the answers will make sense
Electronics Forum | Tue Nov 07 21:49:05 EST 2000 | Dave F
Cheers to you Your gold plating is specified for the gold wire bonding between the die of your BGA and the pads on the BGA substrate. For solderable surfaces this is heavy on gold for use on pads. Gold SB thinner on pads to limit the amount of gol
Electronics Forum | Tue Sep 28 13:17:46 EDT 1999 | Earl Moon
| I finaly get a vacation and decide to go to the forum and low and behold it's hot air verses a small ray of sun.I read every thread and still failed to see any real argument either way? I love rework as an assembler. I hate rework as a shop owner.
Electronics Forum | Tue Sep 28 22:43:26 EDT 1999 | Dean
| I finaly get a vacation and decide to go to the forum and low and behold it's hot air verses a small ray of sun.I read every thread and still failed to see any real argument either way? I love rework as an assembler. I hate rework as a shop owner.
