Electronics Forum: potting (Page 115 of 127)

Solder wave shutdown

Electronics Forum | Thu Jun 07 14:17:55 EDT 2007 | mfgengr

Thank you ChrisW. I agree completely. The decision to idle the temperature or turn the wave off is primarily a function of machine utilization. Period. The utilization % break even point for idle vs. turning the heat off is calculated by comparing th

Safety Glasses

Electronics Forum | Fri Apr 11 13:52:09 EDT 2008 | mika

Hi everybody, In Sweden It's stipulated by government law and has been for more than 40 years; that if you are working in hazardous areas where your eyes could get hurt in industries like grinding, welding, mining facility etc. etc etc. etc. etc. or

Leaded and Lead-Free Wave Parameters

Electronics Forum | Fri May 23 18:55:20 EDT 2008 | gregoryyork

This is one of the biggest mistakes with the Lead Free process. We have all listened to the 'industry experts' and followed their advice and unfortunately got it wrong. Keep the dwell times (dependant on alloy selection) the same as Leaded so you are

Solder balls

Electronics Forum | Thu Jul 17 20:46:55 EDT 2008 | davef

Which type? * Solder beads (mid-chip solder balls, attached to the waste line of your chip caps and resistors) This is more paste volume related. * Solder balls that tend to be more randomly scattered (as in spattered)? This tends to be more profile

very cheap way to reclaim solder from dross

Electronics Forum | Thu Oct 23 09:49:18 EDT 2008 | davef

We're not sure the specifics that BLT Circuit Services Ltd referenced, but many companies use dross reducing agents in their wave solder pots. Among dross reducing agent suppliers: * Fry [4100 Sixth Ave, Altoona, PA 16602; 814-946-1611 F814-944-8094

Replating a Gold Connector

Electronics Forum | Mon Dec 15 16:16:42 EST 2008 | davef

J-STD-001 requires that solderable surfaces of components and connectors be degolded prior to soldering. As proven methods for removal of the gold plating and replacing it with tin/lead, MIL-STD-2000 and J-STD-001 endorse[d] either: * Double dip (two

Processing questions - PCB and BGA's

Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep

We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f

Fuji FCP 2 Check Servo issue

Electronics Forum | Thu Sep 16 18:43:57 EDT 2010 | slwolbert

Hello Daxman, Thanks for the input. Yes, the CP2 is closely related to the CP4 and does have the analog servo amps as you deduced. I did a wiggle test on the connectors and found that the x-y-r servo amp alarmed right away and blinked the x axis a

more info- os error, screen(hex) dump

Electronics Forum | Tue Oct 05 15:39:35 EDT 2010 | daxman

Hi Steve, I don't know if there are a lot of people who can decrypt the trace data. I think the manual mentions sending it to fuji for analysis. Maybe that would be something worth checking into. Regarding the Mecca check mode: I don't know if it wi

Vapor Phase vs Convection for production

Electronics Forum | Fri Jan 28 19:24:15 EST 2011 | jlawson

Should contact Rehm Thermal they have a whitepaper on pros and cons of Vapor Phase vs Convection.... Vapor phase traditionally targeted heavy PCB, large mass products better then lighter ones, due to ramp rate control being harder to attain vs say a


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