Electronics Forum | Fri Jul 08 09:57:31 EDT 2005 | fctassembly
Proy, Another issue is what exact formulation of SAC is used. Much of the SAC305 being used in Asia contains phosphorus, which is added in an attempt to reduce the heavy drossing that SAC305 produces. Phosphorus acts as a flux on steel so will increa
Electronics Forum | Thu Jul 28 09:47:06 EDT 2005 | fctassembly
Hello Carl, The main reason there is little information on lead free soldering to ENIG is because most of the lead free soldering to date has been Japanese consumer products. To keep costs down, the major surface coating used has been OSP copper. It
Electronics Forum | Thu Jul 07 18:10:20 EDT 2005 | russ
You should use Xray to qualify your process. Frequency of Xray inspection after that will need to be determined by your process capability. If you use paste inspection process, once you verify that your profile and placement are good you in theory
Electronics Forum | Tue Jul 12 09:51:42 EDT 2005 | russ
We use the JBC irons with and without the "leadfree" tips. We really have not noticed much difference between the standard and the lead free. The lead free tips do last a little longer but the tips are somewhat deformed by the extra plating. As f
Electronics Forum | Thu Jul 14 09:42:36 EDT 2005 | saragorcos
Our facility helps customers clean no-clean soldered boards on a regular basis, and it definitely can be done but is a little more challenging than boards built with water soluble flux - one piece of advice I would give is to use low water pressure (
Electronics Forum | Mon Jul 18 16:58:31 EDT 2005 | Gpe. E
Hi everybody. I would like to know if any of you guys is using the HP5DX output processor from Assembly Expert to generate de .NDF files for the 5DX machines. I tried but I got a lot of errors because de configuration file for that processor needs
Electronics Forum | Wed Jul 20 10:07:05 EDT 2005 | cecil
Does anyone have any input on the need to bake out an assembly prior to the conformal coat process? I understand baking out components/pwb's prior to processing through the reflow or wave solder process if the material shows excess moisture absorbtio
Electronics Forum | Tue Jul 26 08:20:46 EDT 2005 | Bob R.
All you can do is try it. I did a literature search last year on causes of BGA voiding and came up with a pretty long list, sometimes contradictory. I also discussed it with several paste suppliers. What I came away with is that what aggravates voi
Electronics Forum | Wed Aug 03 10:15:11 EDT 2005 | cyber_wolf
Stefan, Was this machine a Fuji by chance ? Did you buy this machine ? If so why would you or anyone buy a machine sight unseen that is "way overpriced" Just curious.. I have been told by representatives of major SMT machine manufacturers to BEWARE
Electronics Forum | Wed Aug 10 20:30:49 EDT 2005 | slthomas
I've got a new board (actually a new panel...a 4 up, with one row rotated, where it was a 2 up panel with no rotation before) that runs fine on the IVc but not on the IIIc. I've used the same reference points for the image rotation (fiducials) on bot
