Electronics Forum | Sat Mar 24 03:06:55 EDT 2007 | aj
Hi Mika, We came across some difficulties with this type of device a couple of years back . After the proto run we needed to touch up the outside fillets to get stability and product to pass test. ( even though the manf. stated that there is no fill
Electronics Forum | Tue Apr 03 00:37:51 EDT 2007 | grantp
Hi, I think the only solution would be to contact Fuji and ask if there is an interface to the machine to write software for it. I read somewhere that FujiTrax allows a IT system type connection which software could be written for. Another solution
Electronics Forum | Wed Mar 28 12:46:50 EDT 2007 | realchunks
Rob is right, you do need to dispense paste or pre-forms when using a laser. Although the Panasonic Soft Beam has a wire despenser. I've seen laser soldering and it does work on smaller stuff. Doesn't work well on connectors even after preheating.
Electronics Forum | Thu Apr 12 16:59:24 EDT 2007 | flipit
If you want an inexpensive, good, somewhat dedicated, solution, then I would use a desktop wave pot like Wenesco or better yet Air Vac. The PCBRM10 or PCBRM12 from Air Vac may still be available. Can find on Ebay also. They have a quick change, pr
Electronics Forum | Mon Apr 02 09:24:16 EDT 2007 | ed_faranda
I do this ALL the time, and it is pretty much transparent to the process. We have done shake, burn in, and functional tests with our products and we didn't have any issues what so ever. We have had a RoHS complient process for well over 18 months n
Electronics Forum | Wed Apr 04 03:38:04 EDT 2007 | chrissieneale
The two machines in the middle are really really old m/c's so we try as much as possible to not to use them (apart from as very expensive conveyor belts). They run a fixed set up as although we have a bunch of different products they all tend to use
Electronics Forum | Fri Apr 06 10:43:57 EDT 2007 | flipit
Hi, Anyone seeing difficulty is soldering MLFs or QFN with lead free solder? I have an MLF with 3 rows of pads on each of the 4 sides of the part and then the large center ground plane in the middle. The part is 20 mil pitch. Had good luck with l
Electronics Forum | Mon Apr 23 15:44:31 EDT 2007 | flipit
Steve, You read it the same way I read it. Some of my coworkers thought that the 600 micron and under spec meant that you could use lead solder and be exempt at this component pitch. That is why I posted it on SMTNET. The exemption specifically s
Electronics Forum | Wed Apr 25 10:45:25 EDT 2007 | slthomas
I read the request months ago with great interest. However, a request is hardly an exemption. Here's my issue with the language: "23. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead fra
Electronics Forum | Fri Apr 20 15:49:26 EDT 2007 | Theresa Spear
Instead of using adhesives to glue the back side SMD components and wave soldering them together with the through hole components, our manufacturing engineers choose to process the back side components through reflow oven without adhesives and proces
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