Electronics Forum | Wed Jun 15 00:33:11 EDT 2005 | Frank
You didn't state if you are using all CAD data or not. If you are not using any CAD data then all bets are off. If you global fid XY data and all your placement XY data are all from CAD data, but you are manually teaching your local fids, then they
Electronics Forum | Mon Jun 13 11:56:29 EDT 2005 | patrickbruneel
Hi All, There are IPC drafts in circulation IPC-1751, Generic Requirements for Declaration Process Management and IPC-1752, Materials Declaration Management. To me it looks like the regulations become more tolerable towards lead in solder Lead in s
Electronics Forum | Tue Jun 14 10:38:53 EDT 2005 | Stefan
500 rejected (?) per million placed components is a very good rate, considered that it would be better than 4 Sigma if you name it defects on the board. Or do I incorrectly convert ppm to dpm? * 3 Sigma 66,800 defects per one million opportuniti
Electronics Forum | Thu Jun 16 22:14:51 EDT 2005 | davef
16 thou pitch parts: Use a 5 thou laser cut electropolished stencil with 0.008"x0.045" apertures and type 3 solder paste. Bridges Connecting or Partially Connecting Adjacent Leads or Lands * Excessive solder paste * Excessive component placement pre
Electronics Forum | Fri Jun 17 10:47:48 EDT 2005 | davef
Doug: We agree that imm tin can be easily stripped and reapplied. Do you order imm tin as bright/ dull? Is bright/dull a function of who the fabricator lisences the process? Er wha? Electroplate tin can be either matt or bright. It is different
Electronics Forum | Thu Jul 28 09:23:48 EDT 2005 | fctassembly
300 million boards to date). I also have some reliability data for joints made with these 2 alloys wave soldered and then repaired with both. All of these results look good. The issue we see is mixing SN63 with any of the lead free alloys. Sn63 wave
Electronics Forum | Thu Jul 07 09:53:17 EDT 2005 | PWH
Agree with D.B. We have also had to replace the belt that runs the auto conveyor width function. It might look just fine, but it will skip teeth on occasion if stretched or worn. Reparallelling the conveyor rails can be done manually by skipping t
Electronics Forum | Thu Jul 07 18:16:36 EDT 2005 | russ
What size discrete components and have you evaluated your pad geometries? If pads are too far apart this will happen. The flux resudue is simply there because you didn't solder the component. It will stay on top of the solder bump. You can see this
Electronics Forum | Fri Jul 15 06:20:34 EDT 2005 | skandaae@vsnl.net
PLEASE SUGGST ME FOR A PROBLEM CAUSED DURING MY PROCESS In one of the product I am faceing one component tilt after tht reflow oven 1. check the thkickness of the paste found the paste was more reduse the thickness by adujesting the screenprintg s
Electronics Forum | Thu Jul 14 16:07:16 EDT 2005 | saragorcos
Here is a link to a specific article about cleaning no-clean assemblies: http://www.residues.com/pdfs/Clean_No_Clean.pdf Our facility does a lot of contract cleaning and cleanliness testing for various companies around the world, and that study s
