Electronics Forum: building (Page 118 of 220)

Re: Screen printing the board from........

Electronics Forum | Thu Mar 05 23:52:26 EST 1998 | Ron Costa

| Hi Ron, | Your question really opens up a "Pandora's box", but when you say you're not able to print perfectly, what is it exactly that you mean? Is the print lacking volume? Is it mis-registered? Are you bridging? Also, what printers have you used

Lead Free ...

Electronics Forum | Mon Sep 06 10:21:10 EDT 2004 | pioneertechnology

Hi All We have been manufacturing lead free in the UK for about two years now in a fashion. Let me expalin. Two years ago we began to change over our wave solder machines to lead free process. We read all the articles and attended the seminars on

Quad 4c not placing components

Electronics Forum | Wed Sep 04 09:47:41 EDT 2019 | smrsteve

Hello All, I've just bought a Quad 4c pick & place machine. It's so close to actually building boards, but just doesn't quite get there. I was wondering if there's somebody out there with experience of these machines that might be able to help...?

assembleon emerald xi part build

Electronics Forum | Wed Jun 24 15:46:26 EDT 2020 | kumarb

The blue handle CL feeders are 4mm advancement pocket to pocket - suitable for 0402 devices. The green handle CL feedersare 2mm advancement pocket to pocket - suitable for 0201 / 01005 devices. According to Elissa, she did not recommend the use of

Solderability on Immersion Gold

Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader

We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon

Re: HASL vs. ENIG

Electronics Forum | Fri Dec 15 13:57:46 EST 2000 | genny

It is only after the reflow heating process that the peaks may show up, as the solder build up in some vias(due to HASL'ing) might drip down during reflow. I don't think I've ever heard of it being desirable to have a bare copper surface that will ox

tombstoning after wave?

Electronics Forum | Fri Dec 08 11:08:03 EST 2000 | Antonio

Ok fellas, tell me how you'd fix this! I'm having melf connectors that are tombstoning in the wave, NOT the reflow, the wave. I've never seen this before. All other parameters are the same...solder, preheats, placements, the board, building humidi

Glue Witness Pattern Verifiable by FUJI???

Electronics Forum | Tue Dec 05 13:34:51 EST 2000 | NickMata

Hello all, at the present I have some product onto which I glue backside components. I dispense a pattern of "witness" to use as a visual cue as to the quality of the dispensed glue dots. A problem which I have encountered is that operators will oft

Re: Process Characterisation

Electronics Forum | Wed Nov 29 21:05:33 EST 2000 | Michael Parker

Chris- you did not mention some details regarding your processes and volumes. Are you using SMT, PTH, mixed? Machinery involved (automatic vs. manual). Volumes - same 4-20 assemblies, at what periodic rate? Are you doing R&D prototypes only? High or

ammonium sulfate etching process

Electronics Forum | Thu Nov 16 06:13:16 EST 2000 | Adam Seychell

I am currently building a home PCB etching tank based on the ammonia/ammonium sulfate chemistry. The etching system consists of a etching tank, and an electrolytic copper recovery tank. The result is a infinitely replenishable etching system without


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