Electronics Forum: each (Page 118 of 304)

Can you wave solder this part

Electronics Forum | Fri Aug 25 09:01:42 EDT 2006 | russ

We sire don't AJ, We use a single large aperture in center and the outer pads are just reduced our standard which is I believe about mil off of each side or 2 mils in X and Y. As far as side fillet, sometimes we get them sometimes we don't, I attri

Upgrading to less obsolete equipment.

Electronics Forum | Wed Aug 23 04:04:25 EDT 2006 | bobpan

No Steve, Having the chance to work with newer equipment and 'latest and greatest' technology opens your eyes to older 'dated' machines limitations. If your growing and you may be going towards 0402's and even 0603's.......its better to upgrade and

MPM UP2000 Hi-e

Electronics Forum | Wed Aug 30 08:06:45 EDT 2006 | scombs

The reason I asked earlier about Gridlok is that we are using the on 2 Dek Horizon printers (since Jan 06) with edge clamps and they work well. We run them in Auto mode so they conform to the board at each print so I do not have to worry about the op

SMT glue dispensers

Electronics Forum | Thu Sep 21 13:27:09 EDT 2006 | jimmyjames

We 'bend and clip' with good old fashioned needle nose pliers and side cutters. A typical size for a run would be 20-30 boards. Many of our designs are over a decade old and are fully TSO'd (FAA standard) and we can't change anything in the design.

MPM Spare Parts

Electronics Forum | Tue Oct 31 15:45:17 EST 2006 | dman97

Does any one know where to buy spare parts for an MPM UP1500, other than from Speedline themselves? I need to buy replacement foil clamps for my machine, but MPM wants $393 each! It is just a piece of foil, a sharp one at that. I ain't going to spend

BGA crack and strain gauge measurement

Electronics Forum | Sat Nov 25 21:26:55 EST 2006 | callckq

Dear all, I have an issue here where we found BGA crack. Understand from friend, we need to study any possiblity of our own jig or fixture cause this problem via strain gauge measurement..My question: Is there any standard @ specification establish

BGA chip corner epoxy / adhesive?

Electronics Forum | Wed Dec 06 22:46:39 EST 2006 | SMTrework

Hi Dave, This is manufacturer applied epoxy / adhesive to minimize package "lifing" from chassis flexing and thius board flexing. I have seen the complete array area covered with this black or red epoxy in some cases (i.e. the underfill that I've

GSM Belt Transfer

Electronics Forum | Sun Dec 17 18:13:13 EST 2006 | bigdaddysoy9

GLOBAL MEMORY > ALTER MEMORY > MC_READONLY > MC_READONLY [AXIS-ERROR] > ID_MC_READONLY_AXIS_AREA, Then select Axes #9. If you make the changes here, then hit "update", the changes will take effect immediately. Then you can play around and figure out

Copper Finishes versus Layer Thickness

Electronics Forum | Tue Jan 02 14:15:59 EST 2007 | realchunks

I have a new customer that has a print calling for 2oz. copper finish for top and bottom layers, and 1oz. copper finish for the inner 6 layers. Now, they also have a stack up depicting each layer and thickness. It shows the outer layers of copper b

BGA Failure Rate?

Electronics Forum | Wed Jan 03 11:14:26 EST 2007 | realchunks

What is your biggest failure mode? You root cause problem could be anything from poor ICT fixture to bad incoming inspection. Generally, BGA's are a high yield producing component. Just cause they're neat-o doesn't make em' bad. As for 85% yiel


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