Electronics Forum: boarded (Page 1179 of 1638)

Lead free components in 62/36/2 paste prob.

Electronics Forum | Mon Nov 21 01:10:27 EST 2005 | mskler

We are facing the problem of dry soldering in chip capacitor 0603. When we told the Vender then he just told that we are using solder paste with 62/36/2 combination & the components are lead free so there is prob. of dry soldering. While we are usin

Jars versus Cartridges

Electronics Forum | Wed Nov 23 17:24:43 EST 2005 | adlsmt

With Jars you tend to mix used paste back in with new paste and there is also a lot of air in the jar. If you are high mix try using cartridges and putting the used paste in little ziplock baggies. You can rip the baggies open including tearing the s

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Thu Dec 15 12:10:07 EST 2005 | muse95

It should be the other way around. A Pb BGA ball will fully melt in a Pb free process, but a Pb free BGA ball will not fully melt in a Pb process, which means the Pb from the paste on the board will not fully diffuse through the ball. This leads to

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Wed Feb 01 17:03:04 EST 2006 | grantp

Hi, What's the difference between soldering a lead free solder ball BGA onto a footprint with lead solder paste when the ball does not collapse, compared to a lead-less package. The BGA is bigger, but you rely on the solder paste only, seems to work

Solder wetting issues

Electronics Forum | Thu Dec 01 14:24:25 EST 2005 | Amol Kane

Hi, I am having a SAC 305 solder paste with water soluble flux wetting issue. during reflow, the solder melts, but doesnt flow. the reflow profile was developed by the solder company person (Kester). the board is a test assembly to validate our LF pr

BGA ball Separation

Electronics Forum | Mon Dec 05 12:57:59 EST 2005 | Billy D

Dude, make sure you're not getting too hot, too quick. If the BGA "dogears" in the oven, or during a rework procedure, it'll either short, or get very strained, depending on which way the part moves, up or down. Also, bake the hell out of them, as if

Mis-align Component

Electronics Forum | Thu Dec 08 11:50:40 EST 2005 | Stefan

If you mention mis-alignment and missing component in the same sentance, I suspect the component is not properly released after placement. Assuming the Juki machines use an air blow, after vacuum shut off, than I would look at a correct air flow firs

Tin Whiskers

Electronics Forum | Fri Dec 09 11:37:29 EST 2005 | Samir Nagaheenanajar

So, I'm workin' my damn fax machine; unfortunately, it's one of the 1st generation fax machines, because in Riyadh, we get stuck with the old equipment, and then it gives a message on the LCD display: Paper Jam..so I get mad, and yell: WHY DOES IT

Gold Pads Soldering problem

Electronics Forum | Fri Dec 16 01:36:53 EST 2005 | tk380514

i would assume when the PCB planner and customer would specify what "surface layer type"they want but this section is always empty but i have found that out yesterday that we only use ENIG and not FLASH GOLD, which is good to know........ but it see

PVA Conformal Coating Machine

Electronics Forum | Thu Dec 22 10:37:38 EST 2005 | Amol Kane

Hi Steve, We just got the retrofitted machine and i was trained by PVA on Pathmaster. I just wanted to know if many other ppl were using it so i can post any questions/comments on the programming aspect. The coating we will be using is envibar, and


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