Electronics Forum | Sat Mar 24 07:50:04 EDT 2007 | davef
It's possible that 90/10 is being replaced by LF in many ball suppliers' [Alpha Metals, Kester, AIM] inventories.
Electronics Forum | Fri Apr 06 08:17:25 EDT 2007 | davef
Mika: What are the size and shape of the pads on: * Board * Interposer of component Are either of these solder mask defined?
Electronics Forum | Wed Mar 28 09:22:50 EDT 2007 | Rob
Not a fan of bench top, as you have to load the component and the board into a fixture, then unload afterwards. We trialled with 3 linked ones for some complex boards which worked well, however it was not cheap, and not that fast. I'd look at sel
Electronics Forum | Fri Apr 13 08:36:05 EDT 2007 | bartlozie
We bought a Apollo Seiko robot. this, from several test, was way out the best for our production. we use Ichikawa leadfree solderwire, this was the best result with this robot regards bart
Electronics Forum | Fri Nov 14 05:33:47 EST 2008 | bartlozie
I do have exp in setting up the machine, if you explaine me the probleme, maybe i can help you out. (pictures?) regards Bart bart.lozie@page.be
Electronics Forum | Mon Nov 17 12:32:55 EST 2008 | john_smith
Stockley, Where are you now? We are still using the robot that you created. we had to modify the programming (once we figured it out) but it is still working fine. Hope all is going well for you. Thanks John
Electronics Forum | Wed Mar 28 14:40:13 EDT 2007 | amelara98
Unfortunately, the facility overseas does not have a profiler. We suspect it is overheating due to a thick pallet and a raised temperature to compensate for it.
Electronics Forum | Thu Mar 29 09:40:08 EDT 2007 | tammyanne
I'm starting a surface mount company. Can anyone suggest good start up equipment? Temp controlled solder iron, microscope/ magnifying lamp. Any info would be helpful. Thanks.
Electronics Forum | Wed Apr 04 18:27:53 EDT 2007 | Guest
Most CSPs are BGAs. Some are sent without bumps or balls. Thjos eneed to be bumped prior to processing for best results
Electronics Forum | Fri Apr 06 01:10:16 EDT 2007 | Haris
My SMT line does not has these facilities so would you please tell me regarding the UNDERFILL AND FLUX-DIP process and how they can be done? Thanks.
