Electronics Forum | Sun Oct 24 11:20:57 EDT 2004 | sagan
Hello everyone. The company i work for owns a PM570L and a PM460. The PM460 recently came from service repairs and it has a problem that me and the technicians at Zevatech AG are trying to solve but i would like to hear from anyone with experience o
Electronics Forum | Wed Nov 17 08:20:47 EST 2004 | Chunks
Pros are no need to clean after reflow. No need to buy a cleaner or worry about "wet" parts afterwards when you're trying to test your unit. Cons are that most leave a bit of a residue behind. It's harmless but may drive your bed-of-nails tester a
Electronics Forum | Thu Mar 31 06:09:19 EST 2005 | amstech
Yes, components do contribute to the non wets in fine pitch reflow. Oxidation is the main culprit. May ask where it is coming from. Can not say in particular. May be burn in test process or end of line baking, hot / cold testing and need to run DOE'
Electronics Forum | Fri Mar 18 07:51:00 EST 2005 | jh0n
I'm currently trying to do a complete backup of a GSM-1. It's older, and only has one IDE connector (can't add another HDD), and no CD-R. We're having trouble with TCP/IP too. Given that floppy is my only way out right now, and that's pretty unatt
Electronics Forum | Mon May 16 11:45:35 EDT 2005 | PWH
Agree with PDE. We have two GSM's and we get this error often. Palm down e-stop when you get this error message. Machine will drop nozzle bank down after doing some segment repairs. Open covers and make sure nozzles are seated in reference to ali
Electronics Forum | Tue Jun 07 02:53:01 EDT 2005 | Base
Nope, not using it, but have some experience with it. Reliable, versatile, accurate. It is not in a league of its own, but it does everything you want it to at a level you expect it to. Never let me down. It is pretty much like a Toyota family car.
Electronics Forum | Tue Sep 20 17:38:59 EDT 2005 | kmorris
HLY: If you must build product while you wait to get the printer fixed, and if the BGA balls are eutectic solder, your approach is a good one. All solder paste does in this assembly application is supply the flux. Additional solder volume is not ne
Electronics Forum | Fri Nov 11 09:18:28 EST 2005 | chunks
EMI shields are no fun! Your process will depend on your design and condition of the shields. We always break the shields into their own process. Because the shields are never flat, screen printing paste and trying to reflow them only caused huge
Electronics Forum | Tue Nov 15 03:27:46 EST 2005 | Base
Hey Carsten, Couple of questions to get the picture clear about the type of machine you're looking for: - what's the most demanding package you'll be placing? (fine-pitch, BGA, large connectors, etc...) - how much feederbarspace do you hink you'll n
Electronics Forum | Tue Dec 27 10:57:20 EST 2005 | DannyJ
I'm not sure if I understand the question correctly... Mainly, drill the mushroomed end of the rivet with a drill bit that is slightly larger than the shaft size of the rivet and remove the cover. Then, you should have easy access to what you need t
