Electronics Forum | Tue Sep 05 07:38:36 EDT 2000 | JAX
Daniel, I think JOHN and Ramot have some good ideas but I guess I am a little confused. How have you placed BGA's or QFP's in the past. If you are just starting to place them and believe you will continue to in the future, you need to start looki
Electronics Forum | Wed Aug 30 14:57:43 EDT 2000 | John Thorup
Hello Craig Are code dates other than these two coming apart or do they stay together? If other dates stay together you should get together with RFM. Did the process work before and and the defects just start happening? These are pictured on the RFM
Electronics Forum | Fri Aug 25 02:23:38 EDT 2000 | kyung sam park
Hi. smtguys Would you let me know the name of company appling the pihr in smt process. As you know PIHR stands for pin in hole reflow.( pin in paste) I just want to know what company apply the PIHR in smt process. I expect the contents of the c
Electronics Forum | Fri Aug 04 04:26:31 EDT 2000 | Charles stringer
I am experiencing a problem when soldering down a TO263 package. The device has a large solderable tab (approx 8mm square)on the back and 5 leads. Sometimes the leads are not soldered to the board properly. I am using a metal mask with 9 "windows" of
Electronics Forum | Mon Jul 17 20:30:39 EDT 2000 | Dave F
We are trying to improve the decision process for our Material Review Board (MRB. We have a fairly standard defect identification and MRB process. We are pretty comfortable with our ability to: � Identify problems components and assemblies. � Segre
Electronics Forum | Fri Jun 23 09:36:58 EDT 2000 | C.K.
Chrys: Funny that you mention that, but here at my company, our oven is blamed on almost everything: skewing, tombstoning, solder shorts, etc.... In fact, we often have to tell the supervisors, "It's not the oven because we don't turn the skewing
Electronics Forum | Wed Jun 07 09:06:06 EDT 2000 | Stefan Witte
Compared to paper tape, I find a higher defect rate on 0402 components in plastic tape even without the PSA tape. The plastic tape appears to be less shock absorbent and this may be the reason for feeding problems on small components. PSA tape has it
Electronics Forum | Sat May 27 12:50:21 EDT 2000 | Micah Newcomb
Steve, I use homebase apertures as a standard for all chip parts and have no complaints, no solder beading, no issues. I have had to replace almost all stencils ordered previous to my arrival as they all caused defects (7-9mil thickness and 1:1
Electronics Forum | Wed May 03 11:52:09 EDT 2000 | SONO-TEK CORPORATION
John - CK can probably help you further once you answer those questions, but for now what's your top side temp and how are you applying flux? Two of the primary causes for bridging are conveyor instability (vibration) and turbulance in the solder wa
Electronics Forum | Tue Apr 18 08:05:00 EDT 2000 | Wister
Hi, I got an interesting result after completing DOE that more open defects occurred higher the viscosity.The ppm would be 500 while the viscosity is 950 and it would be 1500 while the viscosity is 1050.The range of viscosity is 900 ~ 1100kcps. The p
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