Electronics Forum | Fri Nov 14 03:41:26 EST 2008 | kywl
For your pad layout and spacing between > components, look here: _a class=roll > href="http://portal.ipc.org/Purchase/ProductDetail > .aspx?Product_code=77b562c1-b8f8-db11-8a6a-0050568 > 75b22" > target="_blank"_http://portal.ipc.org/Purchase/Pr
Electronics Forum | Wed Dec 03 14:17:50 EST 2008 | muse95
I am not disputing that cotton gloves are a good idea. They can help protect a lot of parts and surfaces (if the gloves are kept in good clean condition, that is, but that is a whole 'nother thread topic). The fact of the matter is though, paper w
Electronics Forum | Wed Nov 26 03:29:41 EST 2008 | stewartp
I'm currently using 'program maker' to generate SMT programs for our Vitesse. The problem is we were using an old style format for our part numbers.. We have now got a part number system in place, which I now want to add to our vitesse. This will cr
Electronics Forum | Tue Dec 09 18:03:39 EST 2008 | davef
First, you cannot determine foil thickness from its weight per area, because there is significant variation in the density of electrodeposited copper. Second, the official IPC specification for minimum thickness is "after" processing by the fabricat
Electronics Forum | Tue Feb 03 16:42:50 EST 2009 | cuperpeter
Hello All, > > I have a problem with nonwetting Au > finish after second cycle of reflow soldering > doublesided boards. Solder nonwetted pcb pads (is > wicked to component terminations) Either these > pads or some of non component pads became
Electronics Forum | Tue Feb 03 14:19:29 EST 2009 | grics
I would agree if you have a board to setup the process. But sometimes this doesn't work... If for some reason if the customers AVL has a Lead Free BGA and I am running Leaded paste (yes this really happens!), you will need to run hotter to get your
Electronics Forum | Mon Mar 02 15:54:15 EST 2009 | rgduval
That might because every CM has a different overhead rate. In general, your costs should be material+direct labor rate+overhead rate+markup and or profit margin. For your overhead rate, consider your non-direct labor, and your facility costs. Am
Electronics Forum | Wed Feb 04 03:20:05 EST 2009 | smartasp
Hi All Reflow Gurus I have learnt that my process engineers do not consider the heat resistance, of the components when creating a reflow profile but rather try to stick to the paste recommendation. This has lead to a field recall as one component h
Electronics Forum | Sun Feb 08 18:03:26 EST 2009 | davef
Roland What does this thread in the current issue of SMTnet Express newsletter have to do with SMT? Coating Drug-eluting Arterial Stents Using Ultrasonic Spray Nozzles One proven method used to treat clogged arteries employs tubular, mesh-like met
Electronics Forum | Wed Mar 11 17:51:22 EDT 2009 | GSx
Thank you so much Dave, by having different lots of PCB received (same Supllier) with suspected and good carbon ink deposit, I found useful to adopt a comparison test among the different lots by usingthe IPC-TM-650 2.4.1 Adhesion , Tape Testing (lik
