Electronics Forum | Wed Nov 09 09:01:42 EST 2005 | smtspecialist
I was using a combination of Alcohol and then compressed air for a while because I didn't wanted to add new hazardous chemicals into my factory but after looking into Vigon SC200 with a H/F/R of 0 I decided to try it. Since I started to use it, my
Electronics Forum | Tue Nov 15 16:57:22 EST 2005 | bk
If your problem is happening part way through the calibration the problem might be there is too much friction from your Y-wagon. Measure the friction on the Y-wagon using the service program if it fails or if it is near the max allowed try oiling up
Electronics Forum | Mon Feb 13 15:01:37 EST 2006 | Brian W.
We have a joint process with our purchasing department. They get notification from a supplier, which is passed to us. As a CM, we notify the customer and get permission to use it. Then we enter a new part number with a special suffix indicating le
Electronics Forum | Mon Mar 20 09:08:42 EST 2006 | mapell
AR Sounds like dirty chains... couple ways to check... Pull off the drive chain for the conveyor. Place a wrench on the (unload end) drive shaft and spin, if it is a bit tough.. dirty rails. Also look at load end of chains. The chain goes low and w
Electronics Forum | Wed Apr 19 16:43:05 EDT 2006 | samir
Silicone-based coatings "repel" most foreign,non-compatible materials like peelable solder mask, and rubber or vinyl boots. The result is, uncured material around the vicinity of where the boot was. Trust me. Been there and done that. As a rookie
Electronics Forum | Tue Apr 25 10:42:38 EDT 2006 | TMC
Almost all of the components on the bottom side are passives however, there are a couple of mBGA's and qfp's. I am aware that even if the components on the bottom do get reflowed, surface tension of solder will hold them in place. As far as IC's, w
Electronics Forum | Tue Jun 20 10:15:44 EDT 2006 | samir
Again, the verdict is mixed here as well, but from the seminars, white papers, etc. the consensus seems to be that Pb BGA's are not compatible in a Pb-Free RoHS Process...but... Pb-Free SAC BGA's are compatible in a Sn-Pb process as long as your pro
Electronics Forum | Mon Jul 03 05:39:05 EDT 2006 | ronalds
Hi, I am experience problems while testing wave soldering SMT components that are glued on the solderside (lead free). Between de leads of SOx type IC's and SOT's develop a great deal of solder beads. I have been using a RSS temp.profile while spr
Electronics Forum | Mon Aug 21 08:34:09 EDT 2006 | Chunks
Larry, You always seem to twist things back to your wave solder process, ya nut! Anyway, why over simplify things when you are trouble shooting a process? The K.I.S.S. process was invented by your generation so I thought you of all people would l
Electronics Forum | Tue Aug 29 07:40:20 EDT 2006 | CL
Good Morning SWAG, We have the same situation. We have found that for the most part, bottomside components do not move from thier location durring reflow unless pressure is applied. We have had instances where the component is able to drop down into
