Electronics Forum | Fri Jan 19 15:23:22 EST 2007 | SMT GUY
Things to consider... Print alignment - Use off contact Printing and verify board supports - In machine ensure part profile is correct with correct nozzle and thickness - Use support pins in machine to limit placement bounce - Limit input from produc
Electronics Forum | Tue Jan 30 10:33:10 EST 2007 | SWAG
I'm not familiar with the mechanics of a Fuji but when we were learning to run our chipshooter, we did not correctly assign board thickness in the program. This caused the board support pins to warp the board up just enough to push nozzles to a par
Electronics Forum | Wed Feb 07 13:43:33 EST 2007 | realchunks
Board vendors are always right. Unless you build yourself in their facility, at their price. Ways around this are half etch your stencil over the vias, open the resist (mask) on the vias, or use your own product (Sipad). The resist (mask) does app
Electronics Forum | Thu Feb 08 14:55:30 EST 2007 | pavel_murtishev
Good evening, I do. 2mil overprint is not critical. Paste will simply flow back. Paste flows back even with larger overprint (up to 15mil at least). 5mil stencil thickness if fine also. BGA area ratio for both BGAs is higher than 0.66 required by IP
Electronics Forum | Tue Feb 20 18:04:53 EST 2007 | coop
I am not familiar with the YV100XG pick & place but you might want to increase the mount height of these components The double stick tape isn't as thick solder paste. it might be pushing the component too far down causing it to twist. I encountered
Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS
Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil
Electronics Forum | Fri Mar 02 16:26:57 EST 2007 | Steve
1- Thickness 0.005" 2- I usually reduce 50% of the thermal pad, but it also depend on original size of thermal pad somehow I have to either create window panel or crosshatch otherwise component wil get wimming during reflow. Hope this will help. Reg
Electronics Forum | Thu Mar 08 18:39:06 EST 2007 | elias67
Stencil Thickness should be .005" A reduction along with cross hatching is a must for the center pad to reduce paste volume as well as to assure even paste deposit while printing on a large pad. With out the cross hatch, the squeegie will most like
Electronics Forum | Tue Jun 26 15:36:57 EDT 2007 | bjrap3
The board thickness is 50 thousandths. The style of the BGA is a 324 ball BGA that has an isolated center region. The machine that I am using is the Air-Vac DRS25. I'm not too sure why the pads are being removed when I am desoldering. I know when
Electronics Forum | Tue Jul 17 09:49:21 EDT 2007 | slthomas
We haven't used no-lead yet so I can't speak to the specifics of that part of the equation, but am I the only person here that sees "thick board or a board with a large ground plane" and immediately thinks this is a thermal issue? Am I oversimplifyin
