Electronics Forum | Fri Dec 09 07:10:36 EST 2005 | Mity-C
Good Morning, One problem of LF BGA's in a leaded process is the temps required to propperly collapse the BGA balls. If the BGA is LF, the alloy of the balls will not reflow until the temp reaches 217-245 C. SN 63/37 reflows at 183 C. If your profil
Electronics Forum | Tue Jun 20 10:15:44 EDT 2006 | samir
Again, the verdict is mixed here as well, but from the seminars, white papers, etc. the consensus seems to be that Pb BGA's are not compatible in a Pb-Free RoHS Process...but... Pb-Free SAC BGA's are compatible in a Sn-Pb process as long as your pro
Electronics Forum | Fri Mar 02 09:08:25 EST 2007 | samir
There is a formula that determines whether a component will fall off during a 2nd reflow. It takes into account the grams (weight) of the component and the total surface area of the solder joints. I don't know this off the top of my head, but it's
Electronics Forum | Wed Jan 23 19:44:45 EST 2008 | hegemon
In addition to the pre-emptive steps mentioned above, in my experience there are certain BGA package designs that seem more prone to that corner bridging. I have seen some packages that will essentially "curl" down at one corner as the package begin
Electronics Forum | Thu May 08 15:51:06 EDT 2008 | radab
Hi, I have some BGA devices, a plastic FCBGA memory chip (to be replaced) and an exposed-die FCBGA processor here which need reworking. I picked up an Aoyue hot air rework station (http://www.aoyue.com/en/ArticleShow.asp?ArticleID=383) along with t
Electronics Forum | Mon May 12 09:36:05 EDT 2008 | radab
Hi, I have some BGA devices, a plastic FBGA memory chip (to be replaced) and an exposed-die FBGA processor here which need reworking. I picked up an Aoyue hot air rework station (http://www.aoyue.com/en/ArticleShow.asp?ArticleID=383) along with the
Electronics Forum | Wed Dec 24 11:49:46 EST 2008 | bandjwet
Put on your thinking caps for this one......We are trying to remove a BGA (10 x 10mm, plastic, 0.8mm pitch) which is approx 3 mm next to another BGA (5 x 5mm, plastic, 0.8mm pitch). The challenge is this second device is underfilled with a softening
Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70
Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f
Electronics Forum | Sat Apr 04 08:35:27 EDT 2009 | davef
Cause: Solder between the pad and the BGA on the pads being lifted has not melted. So, when you lift the BGA, you also lift those pads with the unmelted solder with the BGA. These pads are probably sinking the heat to a large copper plane in a inner
Electronics Forum | Thu Sep 22 14:54:01 EDT 2011 | hegemon
You might find a lot of experience in the forum here, but maybe not so many consultants for this niche. BGA underfill is not rocket science, and in my opinion, the key items are the material chracteristics, and the dispensing method and pattern. Fo
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