Electronics Forum: chips (Page 123 of 260)

Baking of Thick film resistor chip required

Electronics Forum | Wed Apr 26 08:13:47 EDT 2017 | spoiltforchoice

MSL 1 is unlimited factory floor time before reflow. I have spools that are 10+ years old and haven't encountered any issues using those parts. It goes without saying those parts are not exactly used in volume so its not a massive sample but that is

Chip Component Stacking

Electronics Forum | Wed May 03 02:23:11 EDT 2017 | Rob

Many years ago (20+) we did this by preassembling the 2 parts into a mini leadframe with high temp solder paste, which was a pain but then they could be dropped in trays, surface mounted and hit the line clean. I'm guessing you have a low value cap

Chip Component Stacking

Electronics Forum | Mon Jun 05 10:42:28 EDT 2017 | philc

I guess it all depends on volume. If you are talking thousands of PCB's, then automation is best, if possible. Otherwise, hand-soldering them post-production is the obvious solution. How about bill-boarding them? That way, they would fit on the land

Chip Component Stacking

Electronics Forum | Mon Jun 05 12:30:24 EDT 2017 | deanm

Mike, The dispensable solder paste is ordered separately from the printed paste because it has a higher flux content. I would not feel comfortable mixing liquid flux into the printable paste. Ask your paste vendor if they have a dispensable version.

Chip Component Stacking

Electronics Forum | Mon Jun 05 14:37:55 EDT 2017 | stevezeva

At a past employer we stacked caps and resistors quite regularly. As some have suggested a dispensable paste was used and dispensed by hand and then the stack was placed. At first it was placed by hand, but then we were able to program our Mydata to

Thermal Pads Soldering Worry, can anybody help?

Electronics Forum | Thu Jul 20 23:41:55 EDT 2017 | heros_electronics

Below is an email that I copy and pasted from my customer's engineer about his concerns with the issue of the chips not reflowing (which is why I was asking about X-ray the chips to make sure they reflowed): Can you let me know your thoughts on his

NXP QFN Solderability Wetting Problems, Kester

Electronics Forum | Thu Aug 10 07:29:43 EDT 2017 | stivais

How do you evaluate the soldering quality for those QFNs? X-Ray or AOI? For some QFNs (and other bottom termination components) it's not supposed to have solder fillets on toes. It's also noted in IPC-A-610 (Rev.F 8.3.13). Take a look at your QFN ch

unmarked chip resistors

Electronics Forum | Fri Sep 15 09:08:01 EDT 2017 | rvines1

It gets tricky when resistors that your customer specified are no longer marked, but they think that unmarked resistors are a defect, and the manufacturer hasn't updated their data sheet to show the parts as unmarked, so you don't have anything to sh

unmarked chip resistors

Electronics Forum | Sat Oct 28 08:51:20 EDT 2017 | rvines1

The manufacturer I was having issues with was Panasonic. The parts we use were unmarked, but their catalog pages didn't make any mention of marking and included photos of marked parts. After 6 months of making various unsuccessful contacts with Pan

CuPdAu

Electronics Forum | Tue Mar 13 20:47:39 EDT 2018 | davef

I think of palladium coated copper with gold flash (CuPdAu) as bond wire used in chip attach. Look here: https://www.heraeus.com/media/media/het/doc_het/products_and_solutions_het_documents/bonding_wires_documents/fact_sheets/Factsheet_PdFlash.pdf


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