Electronics Forum | Thu Aug 30 09:56:16 EDT 2007 | blnorman
According to J-STD-033 Table 4-1, the bake out time to restore the clock to zero is not only determined by the MSL level, but the package thickness as well. Section 4.2.2 states "SMD packages shipped in low temperature carriers may not be baked in t
Electronics Forum | Thu Sep 20 15:05:20 EDT 2007 | jax
You can specify the prepreg thickness in the stackup. Once you have specified it somewhere, make your PCB manufacturer build to it... and prove it through cross-section analysis. Depending on the Board cost, we require a cross-section and analysis d
Electronics Forum | Fri Nov 09 15:09:42 EST 2007 | mmjm_1099
Hopefully this will help you. I happen to have a few similar problems with PN# MC33982BPNA. I had the stencil made at 6mil thick and had a step-down for 5mil in the problem areas. That seems to take care of the problem we had at the time. ALSO FORGOT
Electronics Forum | Mon Nov 12 09:22:41 EST 2007 | russ
Could be any one of the 3 you mentioned, need some details here, do you really think we can answer this question as it is? Now for your issue, what is the make up of the lead itself on the part? what is the reflow profile at this part? what is
Electronics Forum | Tue Nov 13 12:25:12 EST 2007 | gradloff
I have a thick board with ground planes that will be soldered by hand with a mildly active solder/flux. X-ray confirmed that solder was added to the top of the joint causing a void between the bottom and top solder joint. Other than the mildly acti
Electronics Forum | Mon Jan 21 18:11:35 EST 2008 | dyoungquist
0.031" radius is a diameter of 0.062" which is very tight (small) for a rounded corner. I would tend to agree with the board house that is can not be done. 0.031" is a standard thickness of PCB. I think it is very possible that your customer swapp
Electronics Forum | Sun Feb 24 10:15:41 EST 2008 | teamcanada
Issue cross talk \Stencil thickness recommendation? 3-4-5 mil Using manufactures recommended paste layout Water soluable vs No clean Paste. Any recommended publications? Only one found so far is Fairchild, recommend NC due to potential cleaning issue
Electronics Forum | Mon Mar 17 07:45:27 EDT 2008 | jackson
Hi SWAG, Bridging most contributed is from printing set up which is the parameter setting as well the board thickness setting. I would suggest you may check the parameter setting which mainly the squegee speed, stencil gap between PCB contact, print
Electronics Forum | Tue Apr 01 12:52:34 EDT 2008 | pstone
Thanks for the insight. Most boards we are seeing problems with are 1.60mm thick (some less) and most of them are panelized. For your support pins what do you use to show operators where the pins should be setup? I have heard of using Plexiglas to m
Electronics Forum | Fri Apr 11 01:52:26 EDT 2008 | andrzej
0,66 Is it ok ? Is it overprinted r - radius of stencil aperture - 9mils ~ 230um t - stencil thickness - 150um Other data : diameter of soldermas - 26mils Diameter of pad - 18mils Diameter of stencil apertre - 18mils Pitch - 0,8mm ~ 31mils What s
