Electronics Forum: 1-10 (Page 13 of 20)

Omniflo 5 high temperature warning

Electronics Forum | Wed Sep 03 07:39:19 EDT 2008 | pjc

You may not be getting enough exhaust pull, so the cooling modules over temp. Try swapping blower motors to isolate that before buying one. STANDARD AIR OPERATION: - Load-end: 150 cfm (255 m3/hr) at the 4� (102 mm) stack (minimum requirement) - Unlo

Printing SEMTECH SLP2710P8 8-pin package

Electronics Forum | Fri Aug 07 07:55:30 EDT 2009 | robhs

Hi. We are planning a production run of a board that utilises the SEMTECH SLP2710P8 8-pin device (2.7 x 1.0 x 0.58mm). The part orientation on the board necessitates that the squeegee print direction approaches the stencil apertures on the long side

FUJI CP642 narrow camera flicker

Electronics Forum | Fri Dec 08 19:02:12 EST 2023 | madisreivik

Found the main problem During messing around (hopelessly :) we had found the calibration menu and pressed "check". Machine thought that there was a calibration nozzle (maybe 10x10mm square) but in reality, there was d=1.0mm nozzle. Machine decided

Mixing no-clean solder with activated

Electronics Forum | Tue Jun 26 19:51:31 EDT 2001 | davef

Rosin. A hard, natural resin, consisting of abietic acid [and pimaric acids in Europe] and their isomers, some fatty acids, and terepene hydrocarbons. Rosin is extracted from pine tree stumps. It�s an organic material distilled from oleoresin in p

Conformal Coat Thickness

Electronics Forum | Mon Jul 23 11:44:40 EDT 2007 | davef

NASA-STD-8739.1, 10.2.3 Thickness Measurements. Thickness measurements shall be made on coupons processed at the same time and under the same conditions as the PWA. The coupon substrate may be any compatible rigid material with a smooth flat surface.

Philips CSM

Electronics Forum | Sun May 18 19:04:54 EDT 2008 | jmelson

OK, here's a sample component file : 1 0.1uF 0.00 1 24 1.00K 0.00 1 22 10.0K 0.00 1 3 1000pF 0.00 1 3 .001uF 0.00 1 25 1.0uF 0.00 1 2 100pF 0.00 1 30 10M 0.00

0402 stencil design

Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef

You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas

smt codes

Electronics Forum | Tue Aug 24 23:04:14 EDT 2004 | pdeuel

If this code is on a ceramic cap then it is a 0.1uf cap. We have a conversion charts that list most all codes. Useing the last 2 digets only determine the value. The capatol letters A thru Z are given specfic numerical value. Example A0 is 1.0pf, A1

Re: Mil-P-28809

Electronics Forum | Fri Oct 08 02:19:01 EDT 1999 | Brian

| Is anyone aware of a web page for military spec's? I am looking for Mil-P-28809. | | Thanks, | Mike Demos | MIL-P-28809 is definitely obsolete. Not only obsolete, it was possibly the most scientifically flawed standard ever to to be printed. I

DEK pro-flow

Electronics Forum | Fri Feb 16 09:30:38 EST 2007 | DEK Answer Guy

Hello PR, PumpPrint� technologies enable high throughput adhesive deposition using a screen printing platform. Careful selection of stencil material, and informed study of the design of apertures and other stencil features, enables a wide range of


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