Electronics Forum | Thu Jun 25 22:34:44 EDT 2020 | daisy_mu
Hello I am working in a PCB assembly company, we are located in Guanajuato, Mexico. We have an SMT line and assembly. We are Katolec de Guanajuato, you can see the information at https://www.katolec.com/ or you can send an email to marcelo-higa@kato
Electronics Forum | Mon Mar 07 06:44:39 EST 2022 | SMTA-64386201
We previously labelled PCBs after assembly but before AOI. Now we need to trace panels during assembly as well, so have the need to apply labels before the assembly process starts. Our stencils are thus not stepped to accommodate labels. I suppose t
Electronics Forum | Fri Apr 15 08:42:23 EDT 2022 | sn
Thank you for sharing the helpful information. Let's say the PCB is a double-side assemble process and this PCB has completed the first reflowing SMT assembly process, is there any concern if the board is kept on the production floor with temperatur
Electronics Forum | Thu Jul 20 12:16:26 EDT 2000 | Dave F
Bob: On "paste push-out" (when inserting a component lead into a through hole pushes the paste out of the hole) in pin & paste assembly: * What factors affect paste push-out? * What techniques reduce this effect, given a board design and component
Electronics Forum | Wed Jun 02 09:21:34 EDT 1999 | Dan Burnikel
Hello all I have a question concerning whether or not there is any special requirements to follow for assembly of a Polyimide PCB card. The customer has the following information on there documentation but since we have never built anything with Pol
Electronics Forum | Wed Apr 28 22:05:05 EDT 1999 | Dave F
Yinns: We've pretty much accepted that in todays low employment rate market that: 1 Chance of hiring an experienced assembler from outside is small 2 Chance of hiring an idiot assembler from outside is small 3 Odds are who ever you hire will be ine
Electronics Forum | Wed Sep 30 11:57:19 EDT 1998 | Manish Ranjan
Hi Everybody Is anyone aware of the possible causes that may lead to voids in the solder bumps after assembly. We assembled some dice on thin substrates and after assembly, void formation in the solder bumps were observed. We have already trie
Electronics Forum | Wed Sep 30 11:56:46 EDT 1998 | Manish Ranjan
Hi Everybody Is anyone aware of the possible causes that may lead to voids in the solder bumps after assembly. We assembled some dice on thin substrates and after assembly, void formation in the solder bumps were observed. We have already trie
Electronics Forum | Mon Mar 04 15:35:18 EST 2002 | caldon
I don't like hand lotions in the assembly area. If hand lotion is needed I would have the operators use latex gloves or finger cots. The lotion can be transfered to the bare board or assembly causing reliability issues. Lotion transfered to a bare PC
Electronics Forum | Wed Jul 09 17:07:51 EDT 2003 | msjohnston
Like many others out there I am new to SMT assembly on flex circuits. In the past, we purchased flex assemblies manufactured from a sub-con. Now we will be building internally. Are there any guidelines when building products with flex circuits? Wa
