Full Site - : chip resistor array issues (Page 13 of 23)

Contamination under chip resistor array

Electronics Forum | Thu Aug 21 08:33:09 EDT 2008 | davef

There is no standard as such. It's easy to see why. It's too complicated and has such a small payoff. Standoff is comprised of: * Package height * Solder thickness between the pad and the component lead * Delta of pad thickness and solder mask For p

Baking of Thick film resistor chip required

Electronics Forum | Wed Apr 26 08:13:47 EDT 2017 | spoiltforchoice

MSL 1 is unlimited factory floor time before reflow. I have spools that are 10+ years old and haven't encountered any issues using those parts. It goes without saying those parts are not exactly used in volume so its not a massive sample but that is

0402 chip resistor - settled sideway after reflow

Electronics Forum | Thu Apr 12 01:23:04 EDT 2001 | Eric C

Check the pad size. I had this issue before due to the pad size too wide. R&D had change the size of the pad and is solve the issue. Before the pad size change, I had rebuild another stencil with the pad opening close to the component size. It won't

Dye Penetration test for area array package failure analysis

Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef

First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis

Re: resistor networks- leadless vs. gull wing

Electronics Forum | Mon Sep 27 04:08:25 EDT 1999 | Earl Moon

| | | I am in the process of picking a new resistor network for one of our new board. Since we are new to SMT i would like to get some opinions on networks. Currently we use one molded gullwing type network on our boards with no problems. Other than

unmarked chip resistors

Electronics Forum | Sat Oct 28 08:51:20 EDT 2017 | rvines1

The manufacturer I was having issues with was Panasonic. The parts we use were unmarked, but their catalog pages didn't make any mention of marking and included photos of marked parts. After 6 months of making various unsuccessful contacts with Pan

Moisture under chip capacitors

Electronics Forum | Thu Sep 11 15:23:31 EDT 2003 | Peter L.

I have come across a rash of failed assemblies that have 0805 capacitors and resistors, bottom side glued, wave soldered and washed. Trouble shooter reported touching up the solder joints on a few areas and the boards would pass test. I had a look a

Ag/Pd termination reflow soldering issues

Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef

Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c

Zevatech 740 RH Head - issues with rotation of component during laser recognition

Electronics Forum | Tue Mar 13 19:27:33 EDT 2018 | maustin

I have an old Zevatech 740 machine that, until recently, was running well. In the last few weeks, the RH head has started giving me issues. When it picks up a component (and early on in most of my programs it will be picking up chip resistors or ca

Zevatech 740 RH Head - issues with rotation of component during laser recognition

Electronics Forum | Tue Mar 20 22:53:16 EDT 2018 | maustin

OK, with my masterful powers of deduction, I have been able to resolve the problem. Upon further investigation, it became apparent that the issue was restricted to those components that had the laser alignment level in the component data set to -0.2


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