Electronics Forum | Wed Sep 29 12:51:55 EDT 1999 | Bob Barr
Never heard of the DRS-22C. I have had a DRS-22 for several years now. Purchased it when we started doing BGA's. The operators like it - good optics (split view), built like a tank, X-Y table easy to manipulate for alignment. I like it because I ca
Electronics Forum | Fri Aug 02 12:07:50 EDT 2002 | johnw
Richard, your asking a multi million dollar question that in my own opinion no one can give you the right answer since no one really knows. hence I think the lack of answers to your question....thought there would be more people willing to propose a
Electronics Forum | Tue Jan 05 10:17:25 EST 1999 | Earl Moon
| | | Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be
Electronics Forum | Fri Feb 24 02:04:50 EST 2017 | soldertraining
Selective Soldering Frames can pull large amounts of heat from the solder wave at the point of contact, effectively lowering the temperature of the solder at the solder joint. You should confirm the temperature of the solder joints by running a therm
Electronics Forum | Mon Jul 25 17:20:47 EDT 2005 | Dreamsniper
I'm confused. A paste Supplier suggested to turn off nitrogen during reflow because it is one source of voiding of bga solder joints...is this true? regards, Dreamy
Electronics Forum | Tue Jul 26 05:57:27 EDT 2005 | GS
Why you do not try by yourself ? Run some BGA reflow with and without N2 then X-ray the solder joints. Regards GS
Electronics Forum | Wed Nov 01 09:01:55 EST 2000 | Thomas Ballhausen
Since your problem has been posted quite some time ago I am eager to know, if you have got any clue. One of my customers recently claimed our 313-PBGA causing problems, as one of its balls (randomly) is almost dewetting. So no evidence is found by x-
Electronics Forum | Sat Jan 23 16:31:09 EST 1999 | Steve Gregory
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
Electronics Forum | Sat Jan 23 17:00:44 EST 1999 | Earl Moon
| | Hi Everyone, | | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly con
