Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef
Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P
Electronics Forum | Thu Dec 21 08:31:32 EST 2006 | Karkanov
Hi, Do you have any idea if there is some tool to inspecet if we have the right component on the board ? like a smart tweezer. Also I'm looking to find a tool to spice smt reel. I need that because our buyer told us they will only buy cut tape.
Electronics Forum | Tue May 22 16:07:31 EDT 2007 | francitj
We are doing a field study to test the placement accuracy and calculate cpk of some machines in our plant. From previous readings, it is suggested that you buy glass board kits from Accuspec, Topline, etc. Is that the easiest/cheapest way to go abo
Electronics Forum | Wed May 20 17:18:09 EDT 2009 | daxman
Just out of curiosity, how are you or anyone else determining a defect? Last I checked, IPC had no criteria yet for solder defects for QFN components. Has this changed? Biggest problems we see are voids which our x-ray shows a lot of. Our problems
Electronics Forum | Tue Feb 24 16:11:15 EST 2015 | emeto
I assume you have a part number system. If so, you should kit the reel with less parts first from the same part number. If you don't use part number system, then you probably have components sorted by value and size, which should lead to the same pri
Electronics Forum | Wed Mar 25 14:46:08 EDT 2020 | stephendo
What about designators? Using gerbers to program a pnp machine was always a last resort to be done only after much complaining and begging for proper CAD data. Back in the day I used UniCAM to program a mydata. After getting it figured out it was eas
Electronics Forum | Thu Mar 31 15:53:23 EDT 2022 | stephendo
And pin outs of both. Once I saw a SOT-6 replaced with a miniSOT-6 (IIRC) The pin outs of the two parts were different. We did make an adaptor board and it wasn't too bad. We populated a panel of the adaptor boards, depanelized them and put them in t
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Sun Aug 26 12:40:59 EDT 2001 | stefwitt
I would like to enter the discussion by tossing some numbers in. First of all I don�t like the 3 Sigma value. 3 Sigma are 2000 defects per mio. if I remember correctly. This means, if you have 200 components on the board, then every 10 boards have on
Electronics Forum | Wed Oct 10 13:35:00 EDT 2001 | stepheno
I used to work with Chris. (neither of us are there anymore). What is he talking about is putting components into "pockets". The parts would come in, in sticks (tubes) but we wanted them in reels. At first we sent them out to be reeled, but that w
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