Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Wed Jun 16 13:36:37 EDT 1999 | Earl Moon
| A potential customer of our is inquiring if we have capability | for Hot Bar manufacturing in the PCBA manufacturing world. If someone can explain to me what this entails, I would greatly appreciate it. Thank you. | One of the earlier uses for
Electronics Forum | Wed Mar 12 12:28:52 EDT 2008 | operator
I recently witnessed a process in which the solder pot operator used Techspray WSOL water soluble masking to cover the areas around a connector that was to be soldered on the solder pot. He did not wait for the WSOL to cure. He soldered immediately.
Electronics Forum | Thu Aug 23 16:28:14 EDT 2007 | grics
I want to get a collective opinion from the forum... I was always under the impression that Humidity at SMT can be a disaster and can cause solder balls... But what about at the Wave/Selective solder? If every board or almost every board has solder
Electronics Forum | Thu Oct 24 10:05:59 EDT 2002 | Yannick
I don't know the name of the flux. but is a no-clean solder paste.
Electronics Forum | Fri Oct 25 05:43:14 EDT 2002 | hanvictor
i have the experience like that, it should have something to do with solder paste.
Electronics Forum | Wed Oct 28 09:37:32 EDT 2015 | capse
An alternative to selective soldering equipment is robotic soldering, like Japan UNIX.
Electronics Forum | Tue Sep 17 15:40:59 EDT 2013 | 18424
Good day all, I wanted to get a quick poll from the folks running SAC305 in their selective soldering equipment. How are final results? How repeatable is the process, any machine related failures? pumps? nozzles? etc... I am just looking to get a
Electronics Forum | Tue Sep 17 15:47:04 EDT 2013 | 18424
Good day all, I wanted to get a quick poll from the folks running SAC305 in their selective soldering equipment. How are final results? How repeatable is the process, any machine related failures? pumps? nozzles? etc... I am just looking to get a
Electronics Forum | Wed Jun 05 21:33:12 EDT 2002 | davef
Tough to say based on what you have told us. Things to Determine are: * Is the heat at the solder connections that are not reflowing properly adequate? * Is the pad surface of the solder connections that are not reflowing properly solderable?
