Electronics Forum | Thu Oct 26 18:10:11 EDT 2000 | ptvianc
Philip: Cases 1-3, those criteria may be specified in more recent versions of ANSI/J-STD-001 and/or ANSI/IPC-A-610. Unfortunately, I do not have any new versions of these specs. that may cover these points. As for voids in BGA joints, I have not
Electronics Forum | Mon May 07 08:46:18 EDT 2001 | CAL
Searching the IPC website is a good start. http://www.ipc.org Some standards you may want to look over are.... IPC 600, IPC 610, J-STD-001 "riveting and circuit cards into metal shelf" definitely has my curiosity level elevated. Since you know your
Electronics Forum | Fri Jul 20 17:09:10 EDT 2001 | davef
Circuits Assembly magazine 09/99 "Defluxing with Ultrasonics" by Les Hymes. [There's more but I can't find it right now. I'll add to this as I find the junk, er very nice stuff.] J-STD-001C states that its OK to use ultrasonics for cleaning so lon
Electronics Forum | Fri Nov 12 10:36:33 EST 1999 | Dave F
Wolfgang: Sure, stacking chip components is common practice in prototyping, as you say, but it's not good practice for production work. Documentation: * ANSI-IPC-275 does not allow stacking * MIL-STD-2000A does not allow stacking * J-STD-001B is u
Electronics Forum | Tue Jun 01 08:30:51 EDT 1999 | Dave F
| I have difficulty to convince my management to air-condition our manufacturing facilities. The room temperature fluxuates from 8 deg.C in the morning to 25 deg. C in the afternoon. The PCB topside temperatures in the reflow oven and wave soldering
Electronics Forum | Thu Jun 03 18:53:27 EDT 1999 | Raeto Zryd
| | I have difficulty to convince my management to air-condition our manufacturing facilities. The room temperature fluxuates from 8 deg.C in the morning to 25 deg. C in the afternoon. The PCB topside temperatures in the reflow oven and wave solderin
Electronics Forum | Fri Aug 14 09:37:36 EDT 1998 | Earl Moon
| Where can I find a spec to put on my fab drawing, to call out the cleanliness of the board, before I recieve it. These boards will require a tight spec after they are assembled, so I want to know that they are clean when I get them. Any suggestions
Electronics Forum | Fri Sep 21 16:00:55 EDT 2001 | davef
In addition to providing guidelines for BGA inspection and repair, IPC-7095 also addresses reliability issues associated with BGA: 7095, �Design and Assembly Process Implementation for BGA's� Your boards should be assembled in conformance with: *
Electronics Forum | Thu Apr 18 17:29:00 EDT 2002 | dason_c
The industrial standard is follow the R.O.S.E test as a guideline per J-STD-001 and the limit is 10ug/sq. inch. Different tester with different equivalent factor with the ROSE and you can refer back to the manual, the Zero Ion tester with equivalent
Electronics Forum | Tue May 14 20:43:55 EDT 2002 | davef
I feel as though I�ve just walked in to a bar, where everyone I was supposed to meet has been drinking for 3 hours. First, the volume of water displacement thing doesn�t make sense, as others have commented. Second, I believe Dave Robbie wants meas
