Electronics Forum: lead length (Page 13 of 21)

BTU Paragon 150 Reflow Oven

Electronics Forum | Mon Apr 24 19:18:40 EDT 2006 | sessioc

OK guys here is the skinny..... > > We need an > oven that can handle lead free temps without > slowing the belt speed under 28 or so in. per > min. > > BTU tells me that they don't recommend an > oven that maxes any less than 350 C. > > Is an

Lead trimming

Electronics Forum | Fri Jul 29 13:30:43 EDT 2016 | gregp

Versatec specializes in the remanufacture of Contact Systems machines, most notably the CS-400E component locator with programmable cut and clinch. these machines are field proven over the past two decades and provide many benefits when utilized: 1.

TNT-A capacitors placement problem at CP-6

Electronics Forum | Sun Dec 31 10:27:39 EST 2006 | pima

Thanks Mika. I will have opportunity to check it out in New Year, because now we dont have production. So far we have beeen using vision type 11 and to be honest this type of defect, that placement of TNTA at flank side, happend very seldom. Usually

Re: SO18 Wavesoldering

Electronics Forum | Sat Dec 16 10:07:04 EST 2000 | Dave F

If I were you, I�d be concerned about waving your SO18 too. What is a SO18? Who makes that package? Regardless, it should be a can of corn, if you: * Orient it so that leads on opposite sides of the component see the wave at the same time. * Incre

Re: Solder woes

Electronics Forum | Mon Aug 07 07:59:49 EDT 2000 | John S

Dave, What type of wave solder are you using? How are the t-sots oriented relative to the direction of travel? You will get the best results with them oriented with the length of the body parallel to the direction of travel. You want the leads or

Voids in every Lead-free BGA solder Joint

Electronics Forum | Mon Nov 25 22:08:05 EST 2002 | Ben

Thanks for the advise. I got the advise from my solder paste vendor to increase the time above melting point for flux outglassing to escape. I tried but no big help. For the moisture issue, actually I've try to bake both the PCB and components at 12

Push&Pull Test of Fine Pitch Components

Electronics Forum | Thu Sep 25 18:37:36 EDT 2003 | adlsmt

Grind the point on a pogo pin from an in-circuit test fixture flat and push on a leg of the component till it bends, mark the deflection, then add about 30% to the length that the pin pushed in (maybe more if your using no clean and the residue adds

Solder joint strength

Electronics Forum | Wed Mar 30 16:07:24 EST 2005 | Dreamsniper

If there's no shear strength standard for solder joint, how will I define my pad width and length then. I have a 8.5 mils width and my component lead width is 8.66 mils based on manufacturer's minimum width specification. How will I identify that it

SMT Component placed upside down

Electronics Forum | Mon Aug 01 17:54:02 EDT 2005 | Stefan

If you are using vib. feeders than the component may be flipped length wise by the following components. Components should be landing with the leads on the right side but upside down. If you are using tape feeders the component may be flipped sideway

Selective Soldering - Lead Free

Electronics Forum | Mon Oct 03 12:22:54 EDT 2005 | Stew

Depending on your application, you may need to pre-heat before Soft Beam (unless they make one for it now). Plus, very small connections seem to push it's limits. The beam can only get so narrow. Lasers are good but reflectivity can come into play


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