Electronics Forum | Wed Mar 06 12:14:34 EST 2002 | caldon
We would benchmark our times with the most experienced operator and them boost the time by 1/3. Example: If it takes Mary 3sec to insert the component, 3 secs to clinch and cut the leads (it is not advised to cut the leads after soldering), and 8 sec
Electronics Forum | Thu Aug 05 08:04:32 EDT 1999 | Peter Barton
| Hi , | | Could DIP package ( PTH) run through IR Reflow instead of wave soldering? | | Will there be any reliability impact on this package. | | Thanks | | Jack | | Jack, The dip component package material and the packaging process is the sa
Electronics Forum | Mon Jan 31 05:25:54 EST 2005 | gaurav
Morning All, > > I have to choice between two > axial through hole machines: Panasert AVK 3 and > Universal VCD Sequencer 8. I will insert axial > components with 0,45 mm to 0,8 mm component lead > diameter and perform jumper wire insertion in t
Electronics Forum | Thu Jul 20 12:16:26 EDT 2000 | Dave F
Bob: On "paste push-out" (when inserting a component lead into a through hole pushes the paste out of the hole) in pin & paste assembly: * What factors affect paste push-out? * What techniques reduce this effect, given a board design and component
Electronics Forum | Tue Aug 14 15:08:32 EDT 2007 | gmoritz
pick/place head won't travel over the LED's, then you won't be able to proceed. I wasn't clear in describing my board layout; It is LEDs on one side and SMT components on the other side. I don't think we can get around the problem of stenciling
Electronics Forum | Tue Sep 04 15:08:51 EDT 2007 | floydf
We have a job that has through hole components on the top, and one 44 pin j leaded PLCC on the bottom. Presently we put the through hole parts in, run it throught the wave, dispense paste on the PLCC pads, and then apply hot air. Someone suggested we
Electronics Forum | Wed Apr 25 10:45:25 EDT 2007 | slthomas
I read the request months ago with great interest. However, a request is hardly an exemption. Here's my issue with the language: "23. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead fra
Electronics Forum | Wed Jan 26 05:24:56 EST 2005 | SLVito
Morning All, I have to choice between two axial through hole machines: Panasert AVK 3 and Universal VCD Sequencer 8. I will insert axial components with 0,45 mm to 0,8 mm component lead diameter and perform jumper wire insertion in the same machine.
Electronics Forum | Thu Mar 25 14:00:45 EST 1999 | Bob Willis
| Rob, | | We are also using intrusive reflow to simultaneously process SMT and Thru-hole components. Our arrangement goes as follows: | | - Screen print solder paste to the single sided PCB using 0.008" laser cut stencil. | - Apply adhesive dots
Electronics Forum | Tue Dec 17 16:27:02 EST 2002 | davef
I�m not clear on the problem. What I get: * Your fabricator did not deliver the product that you asked for in your purchase order. * Pad. Land. A portion of a conductive pattern used as a termination area. Metal surrounding a hole on a printed ci
