Electronics Forum: nickel plating problems (Page 13 of 116)

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 21:17:41 EST 2000 | Dave F

Dave: It's good to know what that stuff is. With your NiO, you have the typical ENIG problem. I can imagine some causes for your disaster: * too thin gold plating * oxidized nickel under gold plating * porous nickel plating * wrong soldering pr

Re: Gold Immersion - Soft Joints

Electronics Forum | Mon Oct 25 15:56:56 EDT 1999 | Dave F

William: Three things: 1 If the gold is porous, it will not protect the nickel and the nichel wiil oxidize and become unsolderable. 2 If the nickel is not solderable, the gold overcoat will not improve that. 3 Ag or Au over electroless Ni creates b

Re: electroformed stencils

Electronics Forum | Fri Jun 04 09:20:55 EDT 1999 | HST-SE

Al, We make stencils, and I was personally involved at AMTX when the electroformed process was developed. Some of this will sound like an ad, but everyone has been volunteering vendors and so look at this as a suggestion. Electroforming is an addit

Re: Gold boards OK with SMT?

Electronics Forum | Mon Aug 10 11:28:19 EDT 1998 | Justin Medernach

| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele

PTH Ring missing

Electronics Forum | Tue Mar 14 13:42:45 EST 2006 | patrickbruneel

If the OSP boards have gone through double reflow I assume that you use an aggressive (halide) flux for wave soldering. SAC 305 is known (search the archives) to dissolve copper faster than other lead-free alloys. This together with an aggressive flu

Re: Gold boards OK with SMT?

Electronics Forum | Thu Aug 06 17:25:55 EDT 1998 | Earl Moon

| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele

Re: BGA warpage

Electronics Forum | Thu Jan 21 15:24:18 EST 1999 | Terry Burnette

| I have received prototype PBGA (256 pins) devices from | Motorola (actual part number = KXPC850ZT50). These parts seemed very warped on the edges. When I put the part on a plain surface, it rocks quite a bit when I press lightly on a corner. I h

HASL, shelf life, IPC standards

Electronics Forum | Mon May 15 12:36:12 EDT 2017 | edhare

I don't believe there should be any issues with > the HASL finish. The issue is how long on the > shelf and is a bake out required to remove > moisture from PCB, as in any FR4 PCB's that may > have had time to absorb moisture. > I don't believe

Re: Gold boards OK with SMT?

Electronics Forum | Thu Aug 06 13:18:30 EDT 1998 | Bob Willis

| | Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not e

Re: Electropolishing Laser-Cut Stencils

Electronics Forum | Sat Jul 11 06:56:03 EDT 1998 | Tom Denison

| Hi all, | We are currently having problems with a laser-cut stencil that is | electropolished and nickel plated with 9-mil openings. The paste does | not release well from the apertures. We are having to wipe after every | print. The board is fixtu


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