Electronics Forum: no solder fillets (Page 13 of 66)

Voids in solder fillet

Electronics Forum | Wed Apr 16 11:20:31 EDT 2003 | russ

What was the original complaint? when you say solder wicked onto top of capacitor do you mean it was dewetted from the board and only on the cap? What type of device showed voiding? how bad was it 20%,50%? I have found that the paste type seems to

Voids in solder fillet

Electronics Forum | Thu Apr 17 14:14:17 EDT 2003 | davef

Takfire Questions are: * Why does your customer think the capacitor is the issue? [What are we thinking? Of course the capacitor is causing this voiding problem. What else could it be?] * What are the type, construction, end-cap material and plati

solder fillet peeling

Electronics Forum | Wed Jul 09 09:27:02 EDT 2003 | MA/NY DDave

Hi Saw a Cross Section picture and thought of you You noted above that you couldn't find any pictures or descriptions of your problem in a few well known sources. It probably is not what you are experiencing yet a soldering defect called land lift

solder balls

Electronics Forum | Tue Jul 17 15:13:53 EDT 2001 | mparker

Dave - I agree that the U shape for QFP's sounds a bit whacked, for the reasons you state. It may work OK for larger pitchs but then again there are a myriad of fixes that work before resorting to U shapes. With the U shape removing paste from under

solder fillet peeling

Electronics Forum | Thu Jul 03 13:10:39 EDT 2003 | slthomas

I snapped a board in half at a cracked solder joint, and the component pulled free of the solder and still has a very thin layer of metal on the termination end. Based on the construction spec.(solder over nickel over palladium), it looks like it

solder fillet peeling

Electronics Forum | Fri Jul 04 08:57:59 EDT 2003 | davef

If you think you have an intermetallic, soldering as probably done correctly. In that case, expect the solder to fail in the solder, just above the intermetallic. This the weakest portion of the solder, because the tin has be depleted to form the i

solder fillet peeling update....

Electronics Forum | Wed Jul 09 18:02:48 EDT 2003 | slthomas

Just when you think you're getting somewhere... QA sent me a vendor response to our corrective action request. They stated that their normal process for this product includes an ultrasonic cleaning cycle of 20 MINUTES minimum. It might be 30, we'r

solder fillet peeling update....

Electronics Forum | Mon Jul 14 16:26:58 EDT 2003 | slthomas

Yes, they do the cleaning, we did the (apparently first) inspection and caught the problems. They tried a shorter cleaning cycle, witnessed no defects, and attributed the defects on the boards we had to their cleaning process. Now they just plan on

solder fillet peeling update....

Electronics Forum | Tue Jul 15 11:18:29 EDT 2003 | slthomas

It is an interesting situation....one that merits as much business philosophy analysis as technical analysis. I'll be getting my official 60 day notice today. Any criticism about our overseas suppliers (that were selected by sr. management w/o in

Has anyone heard of a no clean paste that can be cleaned in straight DI water ?

Electronics Forum | Tue Jan 30 07:29:21 EST 2018 | charliedci

I believe the correct statement (I've been told) is "the process is no clean". The solder paste is "low residue". As a CM, in the past we had customers that insisted on a wash after soldering. We used DI water with a saponifier which had mixed result


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