470 pd ag soldering results

Electronics Forum: pd ag soldering (Page 13 of 47)

36PB/62Sn/2Ag Vs 63Sn/37Pb

Electronics Forum | Tue Aug 14 21:43:44 EDT 2001 | mugen

Basic understanding, 1) the 2% silver (Ag) gives better shine *joint surface*. 2) Ag improves stength & fatigue resistance of solder joints 3) reduces leech-out of silver from silver-base substrates (eg of such silver-base surface contact: metalli

solder paste(SnPbAg)

Electronics Forum | Wed Aug 06 14:49:06 EDT 2014 | dyoungquist

Sn62Pb36Ag2 has a higher liquidus point of 189C as compared to Sn63Pb37 at 183C. You may need to slightly adjust your oven profiles to use it compared to SnPb. We have had good solder-ability and reliability with it in our IPC Class II products. A

Rigid Flex Wave Soldering

Electronics Forum | Wed Apr 04 19:27:07 EDT 2007 | davef

The easiest, long term cheapest, and most accurate way to measure top-side temperature is to use one like: * http://www.amazon.com/Fluke-62-Mini-Infrared-Thermometer/dp/B000MX5Y9C/ref=pd_sbs_auto_2/102-7460227-1828165 * http://www.amazon.com/gp/prod

Re: 2%Ag?

Electronics Forum | Wed Jan 13 22:01:42 EST 1999 | Dave F

| This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. | Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? | | Thanks! | Jenna: We've used

Sn99 Cu0.7 Ag 0.3

Electronics Forum | Wed Apr 20 18:13:32 EDT 2005 | greg york

With twenty five machines working with the LFB227/S on our little island it does seem to work well. Wetting is good compared to Tin/Copper and flow is comparable to 63/37. Biggest problem sticking 3 - 4 % Ag in a solder ignoring the patents and royal

SnPbAg solder paste at reflow oven

Electronics Forum | Tue Nov 21 09:46:19 EST 2006 | jax

I assume you are talking about Sn62Pb36Ag2 solder. You should not see any added concerns when subjecting Sn62 to multiple reflow cycles as compared to Sn63. As compared to Sn63Pb37: Reduced leaching issues Increased Wetting due to lo