Electronics Forum | Thu Feb 17 15:54:18 EST 2005 | Slow Ride
Actually the opposite will happen. A thinner board will heat up faster than a thicker board. That aside, it sounds like you don't have any thermal profiling equipment, do you? This is probably a very good investment if you don't. Take all/most of
Electronics Forum | Tue Jun 17 15:52:51 EDT 2003 | russ
Is this a single sided or double sided board? We run the first side flat on the oven belt this keeps the board flat for the second side assembly. If the board warps during the second reflow process we will make a support fixture to carry the PCBA
Electronics Forum | Fri Mar 20 15:10:54 EST 1998 | Steve Abrahamson
| Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | 1. Cpk's
Electronics Forum | Mon May 14 09:04:58 EDT 2018 | raylawre
We are using ECD OvenRIDER to validate our reflow ovens on a weekly basis to have the data to show our customers that the board we ran 3 months ago saw the same oven condition as the one ran yesterday. Cp/ Cpk is calculated by ECD using a manually i
Electronics Forum | Wed Jul 14 11:27:41 EDT 1999 | Michael Zadrejko
I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it t
Electronics Forum | Tue Jun 25 15:30:49 EDT 2002 | Steve L
Hi everyone. I am now faced with a problem on soldering PBGA. At first, I ran the board (FR4, 7" X 10" with 12 layer) at Peak Temp: 205 C and 54 seconds above 183 C. After reflow, I found several cold solder joints and one ball without second collaps
Electronics Forum | Mon Jan 26 20:11:02 EST 2004 | davef
The primary driver to the set points for your oven is not the board or the number of zones in your oven. It's your paste. If you need a "ball park" guesstimate as a starting point, your equipment supplier is probably the best place to start. So fo
Electronics Forum | Fri Feb 10 12:09:53 EST 2006 | cyber_wolf
Russ, We use a unit called a Datapaq surveyor to monitor our ovens. Its basically a unit that a data logger rides through the oven in. It has 3 thermal couples across the top and 3 across the bottom. It takes measurements the full width of the proces
Electronics Forum | Fri Oct 23 08:24:52 EDT 2009 | rgduval
Eric, I haven't used this oven; but, our Heller has built in profiling. Essentially, attach the thermo-couples to a board, and the appropriate point on the oven, and run a board (without parts). Your paste manufacturer will have published a reco
Electronics Forum | Thu Apr 15 12:58:59 EDT 1999 | Chrys Shea
| | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | I consider "fines" individual unmelted metal spheres that are foun
