Electronics Forum: seho and profile (Page 13 of 24)

Mix Pb and Pb free alloy

Electronics Forum | Wed May 24 16:19:58 EDT 2006 | inds

John, there have been quite a few discussion on Mixed Assemblies in this forum.. do a search.. you will get whole lot of information.. in addition - IF you are using Lead-free reflow profile...make sure the rated temp for Sn-Pb components is not vi

Kester R562 and using lead free components

Electronics Forum | Fri Jul 06 12:11:34 EDT 2007 | james

We are starting to see issues with using Kester WS R562 with lead free components. The joints look grainy on almost all of the 0402'2 and other small components. Some of the solder does not solder to the terminations. These are hybrid boards which

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Thu Aug 22 22:19:13 EDT 2019 | sssamw

From the picture you present, it is a pin in paste part with pin length 2.2mm (a good length for 1.6mm PCB thickness), and seems the pin tilted and touch on PCB surface, thus causes up-part. Sorry I cannot image pin tilted not before placement but i

Kester R562 and using lead free components

Electronics Forum | Fri Jul 06 12:39:01 EDT 2007 | blnorman

What's the metallization on the board? We use an immersion tin board and had to increase our profile to successfully solder.

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Jul 24 10:07:44 EDT 2019 | ameenullakhan

Hi Team, Can anyone suggest me best stencil opening for CCGA. Attached is the component details. Solder paste : water solube - ORL0 - Jtsd 001 ( Sn63/Pb37) Any one has qualified the same. Regards, Ameen

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Jul 24 17:25:01 EDT 2019 | davef

Your solder stencil design should follow all basic rules for solder stencil design are followed in accordance with IPC-7525 including adherence to an area ratio of 2:3 or greater and an aspect ratio of 1.5 or greater.

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 12:47:56 EDT 2019 | davef

Ameen: Send me your email address by selecting the link under my avatar to the left. Thanks.

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Aug 07 02:24:54 EDT 2019 | ameenullakhan

Hi Dave, Yes the lead was there before reflow. After reflow it has bent inside. The component was inspected before placement. We are unable to analyze, what might have went wrong. Regards, Ameen

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Fri Aug 09 03:59:35 EDT 2019 | sssamw

Did you check the pin location accuracy before placement? I mean if possible pin was hit or misaligned a little before placement, so the pin cannot inserted in hole then bent. And maybe you need contact your component supplier to study together.

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Aug 21 13:28:20 EDT 2019 | ameenullakhan

And what is the solder paste selection recommendation for the same. 1. Water soluble ( organic based flux solder based ) 2. No clean ( rosin or resin based solder paste ) customer is suggesting water soluble chemistry , which is having lot hot an


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