Lewis & Clark | http://www.lewis-clark.com/product/2016-mycronic-my200dx-14-pick-and-place-2/
Range HYDRA Fine Pitch Proactive Replenishment Monitor Condition: Complete & Operational Shipping: FOB Origin Availability: Immediate for purchase / 4-8 weeks for shipping Dropbox Link to additional machine photos: https
Lewis & Clark | http://www.lewis-clark.com/product/2012-4-piece-juki-pick-and-place-line/
: 410mm x360mm Max Component height of 20mm (4) MLNA Laser Heads (1) Fine Pitch Head (1) LNC60 Laser Centering Unit Recognition system Electrical protection (1
Lewis & Clark | https://www.lewis-clark.com/product/2012-4-piece-juki-pick-and-place-line/
: 410mm x360mm Max Component height of 20mm (4) MLNA Laser Heads (1) Fine Pitch Head (1) LNC60 Laser Centering Unit Recognition system Electrical protection (1
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/wire-pull
). Nordson DAGE bondtesters fully conform to or exceed these standards. The standards contain specifications for acceptance or rejection criteria. Small geometry (Ultra Fine Pitch
Lewis & Clark | https://www.lewis-clark.com/product/2016-mycronic-my200dx-14-pick-and-place-2/
Range HYDRA Fine Pitch Proactive Replenishment Monitor Condition: Complete & Operational Shipping: FOB Origin Availability: Immediate for purchase / 4-8 weeks for shipping Dropbox Link to additional machine photos: https
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/products/selective-soldering-systems?con=t&page=8
Sheet_English Nordson SELECT Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components Nordson SELECT Bob Klenke (Circuitnet, November 2019
Baja Bid | https://bajabid.com/product/mydata-my200sx-14-smt-pick-place-2014/
-pole test Hydra Electrical measurement Hydra high speed Fast place sequence Hydra large component range Hydra fine pitch Use outer slots Condition: Complete
Baja Bid | https://bajabid.com/wp-content/uploads/2021/05/MY300-SX-Brochure.pdf
° IPC 9850 fine pitch repeatability 3 (X, Y, Theta) (4) 21 μm, 0.05° IPC 9850 fine pitch accuracy @ Cpk = 1.33 (X, Y, Theta) (4, 5) 35 μm, 0.09° SYSTEM FEATURES MY300SX On-the-fly mount order optimization Vision autoteach with snap-to-grid Automatic illumination settings Intelligent feeder concept
| http://etasmt.com/te_news_industry/2021-09-01/24165.chtml
. With the improvement of the packing density and fine pitch (Fine pitch) assembly technologies ,the nitrogen reflow process and equipment improve the quality and yield of the reflow soldering
| http://etasmt.com:9060/te_news_industry/2021-09-01/24165.chtml
. With the improvement of the packing density and fine pitch (Fine pitch) assembly technologies ,the nitrogen reflow process and equipment improve the quality and yield of the reflow soldering
