Double-sided Aluminium PCB Layer count: 2 Material: Bergquist HT-04503 Aluminum Board thickness: 1.6mm Copper thickness: 1oz Thermal conductivity: 2.2W/m-K Breakdown voltage: 6.0KV Application: LED light
Single-sided LED PCB/Star board Layer count: 1 Material: Polyronics TCB Aluminium base Board thiness: 1.0 mm Thermal conductivity: 2.0W/m-K Break down voltage: 3.0 KV Profile: Punch Surface treatment: HAL( lead free) Application: High
MCPCB refers to the metal base printed circuit board (Metal Core PCB, MCPCB), that is, the original printed circuit board affixed to another better thermal conductivity of the metal, can improve the cooling circuit board level
New Equipment | Test Equipment
The Temptronic® ThermoSpot® benchtop systems for temperature testing integrated circuits including high-Watt emitting devices. It consists of a highly responsive benchtop temperature forcing unit that feeds a thermal probe head through a flexible um
New Equipment | Wave Soldering
Wave solder finger L type 7-c450126 Vitronics Soltec Delta 6622CC TITANIUM Grade 1 Commercial pure titanium Chemical composition (weight %) (Maximum values unless range is shown) O N C
New Equipment | Wave Soldering
Wave solder finger V type 7-c450001 Vitronics Soltec Delta 6622CC TITANIUM Grade 1 Commercial pure titanium Chemical composition (weight %) (Maximum values unless range is shown) O N C
Technical Library | 1999-07-21 09:00:55.0
Isotropic conductive adhesives are typically silver filled epoxy resins. Electronics assemblers have evaluated these materials for a variety of unique interconnect applications. The goal is a conductive polymer that exhibits similar reliability and performance to traditional solder while offering the benefits of a polymer structure such as low temperature processing and good thermal stability as well as the ability to bond a variety of substrates.
Industry News | 2018-12-08 03:24:24.0
RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ
(Albany, NY) March 26, 2023 YINCAE, a leading manufacturer of high-performance electronic materials, has announced the release of its breakthrough product: Thermal Underfill - UF 158A2. Designed for use in a variety of electronic devices, not
Technical Library | 2020-10-14 14:33:36.0
Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.
