Electronics Forum: soic? (Page 13 of 37)

reflow / soldering temperature

Electronics Forum | Mon Apr 09 14:05:25 EDT 2001 | slthomas

CAL's word of caution is right on. We tend to stay in the 220C-225C max. temp. on our profiles, and that's because the last heads up from engineering came on a part with a spec. of 230C max. temp. We just found out that one of our old SOIC's is spe

Re: thanks

Electronics Forum | Wed Jan 19 22:28:20 EST 2000 | Dave F

Taking things from a slightly different angle: Cost of assembling various packages based on volume: C/R placement: |$0.01 to 0.04 per part SOIC: | $0.03 PLCC based on lead count: | 20-39 $0.16 | 40-59 $0.18 | 60-79 $0.20 | 80-

Need advise on regarding Vias

Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin

Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&

Re: Hot Bar Mfg.

Electronics Forum | Wed Jun 16 13:36:37 EDT 1999 | Earl Moon

| A potential customer of our is inquiring if we have capability | for Hot Bar manufacturing in the PCBA manufacturing world. If someone can explain to me what this entails, I would greatly appreciate it. Thank you. | One of the earlier uses for

Re: Hot Air Nife

Electronics Forum | Wed Apr 28 16:41:52 EDT 1999 | KH (factor)

| Anyone using hot air nife for wave soldering process. | Does it work? | Does it really eliminate solder bridging and does it create any other problems? | | any feed back will be much appriciated. | | Thanks | | Tony A Hi Tony I have bought a

Re: pads size

Electronics Forum | Tue Apr 06 16:09:25 EDT 1999 | Dave F

| Hi, | Somebody know how to calculate the size of pads for different IC's: QFP's, SOIC, SOJ, etc. | | any help is apreciated. | | thanks | | AC | Al: Justin's comments are well taken. Who should know better about pad sizes that the component m

Re: Adhesive dispension

Electronics Forum | Mon Mar 01 23:57:00 EST 1999 | Erhan Kaya

"DIP, VCD" -> "smt secondary" type of process flow. In that case, dispensing becomes a must. Dispensing needs less setup than printing, but takes longer. So, for a prototype manufacturer, dispensing becomes the best choice. Sometimes a machine dispe

SMT line

Electronics Forum | Wed Jan 20 12:04:44 EST 1999 | DDC

Need to know from your experience a set of smt equipment for low volume manufacturing (approx. 800K parts/yr). Types to handle are standards i.e., 0404-7343, soic's, plcc's, pqfp, tsop, soj, BGA, chip res. smt conn. I would like to know a recommende

Re: HSP

Electronics Forum | Thu Jan 14 10:25:36 EST 1999 | J. Coogan

Doug The 4796A and 4796R machines maintain maximum tact time within an XY table movement window of approximately 17mm. In addition, due to their ability to perform "on-the-fly" theta correction, they are also able to maintain top speed for a larger

Re: bleeder pad !

Electronics Forum | Thu Dec 10 13:27:36 EST 1998 | Dave F

| Dear everybody : | Does anyone have some information about "bleeder pad"? it seems a method to avoid solder shorts across very small SMT pads.If someone have any idea about it, please contact with me , thanks ! | Young: I'm unfamiliar with the


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