Electronics Forum: solder mask surface energy (Page 13 of 35)

White Residues

Electronics Forum | Wed Aug 17 17:41:58 EDT 2005 | Kris

What is the surface finish of the board ? Some flux are known to react with certain type of board chemistry. Have you verified the compatibility of your solder mask and flux ?

Conathane CE 1155-35 Conformal Coating Issues

Electronics Forum | Tue Sep 27 11:46:02 EDT 2005 | jimby

surface tension of solder mask material on the board. Need to rough it up prior to board assembly. Use Silica (cabosil) and IPA mixture and rub

PCB Surface Question - Picture attached

Electronics Forum | Wed Mar 24 01:22:38 EDT 2010 | itzikbs

These boards had solder mask issues, where manufecter took the boards and said he will rework them. All boards has the same problems as in the picture attached. We rejected the boards, but still I appriciate an explanation what can go wrong if I us

Minimum Component Spacing with Minimum Solder Mask Width of 4mils

Electronics Forum | Mon May 19 15:13:05 EDT 2014 | davef

Consider this combination: * IPC-7351B - Generic Requirements for Surface Mount Design and Land Pattern Standard * IPC Tools & Calculators [ipc.org/contentpage.aspx?pageid=PCB-Tools-and-Calculators ] * Component fabricator suggestions BR ... davef

Solder Mask Bubbling off after Wave Soldering

Electronics Forum | Mon Apr 03 23:17:51 EDT 2000 | Brian G

We have been experiencing intermittent problems with the solder masking bubbling up from the bottom side of the board, after wave soldering. Our board fabricator claims that none of his other customers are experiencing this problem, and that it is pr

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 11:05:53 EST 2000 | Russ

I usuallly like to have the pad size the same size as the ball up to +2mil, the pcb solder mask opening to be +4 mil from the pad size (I have found this to aid in Xray inspection for opens since you can see the little tail of the solder wicking up t

Hirose Connector /through Hole Mounting Pin Soldering

Electronics Forum | Tue Jan 27 10:31:14 EST 2015 | dbrazel83

We have a surface mount connector from Hirose that has two through hole mounting pins on the side. The solder is wicking up the pins into the body of the connector during reflow, even with adjustments to the PCB solder mask which came directly direc

Micro BGA pads, adhesion to laminate

Electronics Forum | Thu Jul 10 09:55:47 EDT 2003 | davef

A reading of the pictures is: A1: Looks like pad [B1] is smaller than the other pads. It�s weird that the pads are such different colors. A2: Looks like pad [B1] is smaller than the other pads. Solder mask opening [B1] is misregistered and seems s

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 10:52:41 EST 2000 | JAX

Robert, Here's my recommendation's: Solder paste opening on screen should equal the solder mask opening on board. Stencil thickness at .008" but this should not be your main concern as stencil thickness should be determined by the fine pitch that ar

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 10:52:41 EST 2000 | JAX

Robert, Here's my recommendation's: Solder paste opening on screen should equal the solder mask opening on board. Stencil thickness at .008" but this should not be your main concern as stencil thickness should be determined by the fine pitch that ar


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