Electronics Forum | Fri Jan 16 12:03:46 EST 2009 | black5629
We are encountering similar problem as yesterdays posting, with solder not sticking to the pads but wicking to the leads on Leaded HAL finish boards, except we have tried two different solder paste lots with similar result. The oven profile and paste
Electronics Forum | Tue Mar 30 17:52:15 EDT 2010 | cusackmusic
They are very finiky. If you have good solder paste, and a slight down pressure, to make sure the LED is "stuck" to the board, you should be able to place it. Pick it up on the center of the flat, NOT the lens. Even with the vacuum turned off, t
Electronics Forum | Tue Jul 13 05:21:04 EDT 2010 | bubbobbed
Guys, I've received complaints from customer that the chip is sticking on the cover tape or carrier tape when detape. Is there any possible that i can solve the problem by changing the cover tape or carrier tape?? some say the root cause of this issu
Electronics Forum | Fri May 20 09:13:58 EDT 2011 | ck_the_flip
We have issues with the Philipps Luxeon Rebel LED where the part sticks to the cover tape during advancement. This causes the part to get flopped around in the pocket or the component gets dropped and damaged when the feeder advances. Has anyone ex
Electronics Forum | Thu Aug 03 20:51:27 EDT 2017 | OrHorti
I did a test where the leds were put into a 95% humidity at 60 degC environment for an hour, and after that almost all leds would stick into the carrier tape. So, moisture might certainly play a major role in the stickiness of the leds. We placed al
Electronics Forum | Wed Jan 23 12:49:44 EST 2019 | nikevoo1
next step, if the nozzle have to take the same component, the nozzle is going to take it and the both components stick together(one over the other) and the nozzle places them like this stick together. So there is nothing in one place, and on another
Electronics Forum | Mon Jan 09 19:55:32 EST 2006 | davef
"Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release better than chemical etched stencil 2 Process * Snap-off dis
Electronics Forum | Tue Aug 01 08:52:53 EDT 2006 | davef
We never changed any thing after moving to imm silver. "Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release bette
Electronics Forum | Wed Nov 04 07:39:34 EST 2009 | vetteboy86
We have started using an RGB LED and today ran the first boards down our line. I noticed an immediate issue with placing these. I'm using a quad QSP-2. The part sticks to the nozzle. The nozzles are clean. I have adjusted machine handling so that vac
Electronics Forum | Mon May 06 16:34:20 EDT 2019 | tey422
First of all, I am not familiar with the machine you stated. But there is something you should check out. That is if the nozzle tips having solder paste stick to it or not. If nozzle tips having a fresh paste stick to it, the component might not a
